885 B
885 B
| 1 | Name | Description | Flags | Value | Unit |
|---|---|---|---|---|---|
| 2 | (via4.1) | Min and max L and W of via4 | 0.800 | µm | |
| 3 | (via4.2) | Spacing of via4 to via4 | 0.800 | µm | |
| 4 | (via4.3) | Only min. square via4s are allowed except die seal ring where via4s are (Via4 CD)*L | 0.8*L | ||
| 5 | (via4.4) | Via4 must be enclosed by Met4 by at least … | 0.190 | µm | |
| 6 | (via4.irdrop.1) | For 1 <= n <= 4 via4's on the same connector, mcon area pre- and post- Cu conversion must differ by no more than… | CU IR | 0.0 | µm |
| 7 | (via4.irdrop.2) | For 5 <= n <= 10 via4's on the same connector, mcon area pre- and post- Cu conversion must differ by no more than… | CU IR | 0.2 | µm |
| 8 | (via4.irdrop.3) | For 11 <= n <= 100 via4's on the same connector, mcon area pre- and post- Cu conversion must differ by no more than… | CU IR | 0.5 | µm |
| 9 | (via4.irdrop.4) | For n > 100 via4's on the same connector, mcon area pre- and post- Cu conversion must differ by no more than… | CU IR | 0.8 | µm |