skywater-pdk/docs/rules/assumptions/02-mins.csv

1	Layer Name		Feature Size	Space Size	Feature Name	Space Name
2	Field Oxide		0.14	0.27	FOMCD	FOMCDSP
3	Deep N-Well		3	6.3	DNMCD	DNMCDSP
4	P-Well Block Mask		0.84	1.27	PWBMCD	PWBMCDSP
5	P-Well Drain Extended		0.84	1.27	PWDEMCD	PWDEMCDSP
6	N-Well		0.84	1.27	NWMCD	NWMCDSP
7	High Vt PCh		0.38	0.38	HVTPMCD	HVTPMCDSP
8	Low Vt Nch		0.38	0.38	LVTNMCD	LVTNMCDSP
9	HLow VT PCh Radio		0.38	0.38	HVTRMCD	HVTRMCDSP
10	N-Core Implant		0.38	0.38	NCMCD	NCMCDSP
11	Tunnel Mask		0.41	0.5	TUNMCD	TUNMCDSP
12	ONO Mask		0.41	0.5	ONOMCD	ONOMCDSP
13	Low Voltage Oxide		0.6	0.7	LVOMCD	LVOMCDSPCSMC
14	Resistor Protect		1.27	0.84	RPMCD	RPMCDSP
15	Poly 1	Endcap/Gap	0.15	0.21	P1G
16	Poly 1		N/A	0.14	P1MCD	P1MCDSP
17	N-tip Implant		0.84	0.7	NTMCD	NTMCDSP
18	High Volt. N-tip		0.7	0.7	HVNTMCD	HVNTMCDSP
19	Lightly Doped N-tip		0.7	0.7	LDNTMCD	LDNTMCDSP
20	Nitride Poly Cut		0.27	0.27	NPCMCD	NPCMCDSP
21	P+ Implant		0.38	0.38	PSDMCD	PSDMCDSP
22	N+ Implant		0.38	0.38	NSDMCD	NSDMCDSP
23	Local Intr Cont.1	Slotted	0.17	0.17	LICM1SLCD	LICM1SLCDSP
24	Local Intr Cont.1	Core	0.19	0.35	LICM1CD	LICM1CDSP
25	Local Intrcnct 1	Core	0.14	0.14	LI1MCD	LI1MCDSP
26	Local Intrcnct 1		0.17	0.17	LI1MCD	LI1MCDSP
27	Contact		0.17	0.19	CTM1CD	CTM1CDSP
28	Open Frame Mask		N/A	N/A	OFMCD	OFMCDSP
29	Metal 1		0.14	0.14	MM1CD	MM1CDSP
30	Metal 1 - Cu		0.14	0.14	MM1_CuCD	MM1_CuCDSP
31	Via		0.15	0.17	VIMCD	VIMCDSP
32	Via - Cu		0.18	0.13	VIM_CuCD	VIM_CuCDSP
33	Capacitor MiM		2	0.84	CAPMCD	CAPMCDSP
34	Metal 2		0.14	0.14	MM2CD	MM2CDSP
35	Metal 2 - Cu		0.14	0.14	MM2_CuCD	MM2_CuCDSP
36	Via 2-TNV		0.28	0.28	VIM2CD	VIM2CDSP
37	Via 2-S8TM		0.8	0.8	VIM2CD	VIM2CDSP
38	Via 2-PLM		0.2	0.2	VIM2CD	VIM2CDSP
39	Via 2-Cu		0.21	0.18	VIM2_CuCD	VIM2_CuCDSP
40	Metal 3-TLM		0.36	0.36	MM3CD	MM3CDSP
41	Metal 3-S8TM		0.8	0.8	MM3CD	MM3CDSP
42	Metal 3-PLM		0.3	0.3	MM3CD	MM3CDSP
43	Metal 3-Cu		0.3	0.3	MM3_CuCD	MM3_CuCDSP
44	Pad Via		1.2	1.27	VIPDMCD	VIPDMCDSP
45	Via3-PLM		0.2	0.2	VIM3CD	VIM3CDSP
46	Via3-Cu		0.21	0.18	VIM3_CuCD	VIM3_CuCDSP
47	Inductor-TLM		2.5	2.5	INDMCD	INDMCDSP
48	Metal 4		0.3	0.3	MM4CD	MM4CDSP
49	Metal 4-Cu		0.3	0.3	MM4_CuCD	MM4_CuCDSP
50	Via4		0.8	0.8	VIM4CD	VIM4CDSP
51	Metal 5	All flows except S8PF*/S8PIR*	0.8	0.8	MM5CD	MM5CDSP
52	Metal 5	S8PF*/S8PIR*	1.6	1.6	MM5CD	MM5CDSP
53	Nitride Seal Mask		3	4	NSMCD	NSMCDSP
54	Pad (scribe protect)		2	1.27	PDMCD	PDMCDSP
55	Polyimide		5	15	PMMCD	PMMCDSP
56	Polyimide_ExtFab		5	15	PMM[E]CD	PMM[E]CDSP
57	DECA PBO		10	10	PBOCD	PBOCDSP
58	Cu Inductor/Redist.		20	20	CU1MCD	CU1MCDSP
59	Serifs		0.1	0.1	SERCD	SERCDSP