2.6 KiB
2.6 KiB
| 1 | (cpbo.-.-) | 1st polyimide (mask) | ||
|---|---|---|---|---|
| 2 | Function: Opens over the pad openings; Allows RDL layer to connect to top metal | |||
| 3 | wlcsp.1 | Min cpbo diameter over bond pad passivation opening | 20.00 | |
| 4 | wlcsp.2 | Min bond pad passivation opening to create cpbo | 35.00 | |
| 5 | wlcsp.3 | Min enclosure of cpbo over bond pad by pad:dg | 7.50 | |
| 6 | (rdl.-) | Re-distribution | ||
| 7 | Function: Re-distribution layer connects the top metal from the customer to the bumps | |||
| 8 | x.1 | Polymer 1 via and RDL1 capture pad should be designed as large as possible. The shape can be a circle, octagon, oblong, or a square with rounded corners. The via is not required to be centered within the passivation opening. Any offset is acceptable as long as the minimum overlap design rules are met | exempt x.3a | |
| 9 | x.2 | Fillet or “teardrop” is required between the trace and the RDL1 UBM capture pad to reduce stress and avoid 90°or acute angles which can cause over etching. If room permits, the fillet width shall be 90% of the RDL 1 UBM capture pad diameter and set back from pad shall be the same as the trace width. | add teardrop | |
| 10 | x.3 | Trace width and spacing shall be made equal and maximized where possible for optimized manufacturability, reliability and improved electrical performance (minimum width and spacing shall be limited to a localized area). | Best practice | |
| 11 | wlcsp.1 | Min rdl pad diameter over bond pad | 40.00 | |
| 12 | wlcsp.2 | Min spacing between rdl and rdl larger than 30 um by 30 um and a run length > 60um | 15.00 | |
| 13 | wlcsp.3 | cpbo (with max width of 30x30 must be enclosed by rdl by at least | 10.00 | |
| 14 | (cpmm2.-.-) | 2nd polyimide | ||
| 15 | Function: 2nd polyimide layer acts as a via between RDL and UBM | |||
| 16 | x.1 | Capture pads are identified by (rdl and bump) enclosing pmm2 | ||
| 17 | wlcsp.1 | Min spacing, no overlap, between cpbo and cpi2 on different nets | 25.00 | |
| 18 | wlcsp.2 | Min enclosure of cpbo by cpmm2 (no straddle) | 15.00 | |
| 19 | wlcsp.3 | Min cpmm2 pad diameter | 155.00 | |
| 20 | wlcsp.4 | Min diameter of rdl capture pad under cpmm2 | 235.00 | |
| 21 | wlcsp.5 | Min enclosure of rdl by cpmm2 | 15.00 | |
| 22 | wlcsp.6 | Minimum remaining fraction (polymer 2) size of full via size\nAdd a radius or chamfer on sharp corners of truncated 2nd polyimide via and corresponding RDL capture pad. | 0.5 | |
| 23 | (ubm.-.-) | Under bump metal | ||
| 24 | Function: Layer added underneath the bump balls | |||
| 25 | 1 | Min width of ubm (for parallel opposite edges) | 215.00 | |
| 26 | 2 | pmm2 must be enclosed by ubm by atleast | 15.00 | |
| 27 | 3 | Min spacing between center of ubm and outer edge of the seal ring | 250.00 | |
| 28 | (bump.-.-) | Bump balls for WLCSP | ||
| 29 | Function: WLCSP bump balls | |||
| 30 | 1 | Min width of bump (for parallel opposite edges) | 264.00 | |
| 31 | 2 | Min/Max pitch spacing between bump (center to center w/2x snapGrid tolerance) | 400.00 |