1.9 KiB
1.9 KiB
| 1 | Allowed pitch | Supported flows | Allowed pitch | |||
|---|---|---|---|---|---|---|
| 2 | 400 um | 500 um | s8p-5r\ns8p-10r*\ns8pf-10r*\ns8pfn-20r*\ns8p12-10r*\ns8spf-10r* | 400 um | 500 um | |
| 3 | (pi1.-.-) | (pi1_500.-.-) | 1st polyimide layer for WLCSP | |||
| 4 | Function: Opens over the pad openings; Allows RDL layer to connect to top metal | |||||
| 5 | 1 | 1 | Min width of pi1 (for parallel opposite edges) | 35.00 | 35.00 | |
| 6 | 2 | 2 | Min spacing between pi1 | 20.00 | 20.00 | |
| 7 | 3 | 3 | pi1 must be enclosed by pad by atleast | 7.50 | 7.50 | |
| 8 | (rdl.-) | (rdl_500.-) | Re-distribution layer | |||
| 9 | Function: Re-distribution layer connects the top metal from the customer to the bumps | |||||
| 10 | 1 | 1 | Min width of rdl (for parallel opposite edges) | 10.00 | 10.00 | |
| 11 | 2 | 2 | min spacing between two rdl | 10.00 | 10.00 | |
| 12 | 3 | 3 | pi1 must be enclosed by rdl by atleast | 10.00 | 10.00 | |
| 13 | (pi2.-.-) | (pi2_500.-.-) | 2nd polyimide layer for WLCSP | |||
| 14 | Function: 2nd polyimide layer acts as a via between RDL and UBM | |||||
| 15 | 1 | 1 | Min width of pi2 (for parallel opposite edges) | 170.00 | 220.00 | |
| 16 | 3 | 3 | Min spacing, no overlap, between pi1 and pi2 | 25.00 | 25.00 | |
| 17 | (ubm.-.-) | (ubm_500.-.-) | Under bump metal | |||
| 18 | Function: Layer added underneath the bump balls | |||||
| 19 | 1 | 1 | Min width of ubm (for parallel opposite edges) | 215.00 | 250.00 | |
| 20 | 3 | 3 | pi2 must be enclosed by ubm by atleast | 15.00 | 15.00 | |
| 21 | 4 | 4 | ubm must be enclosed by rdl by atleast | 10.00 | 10.00 | |
| 22 | 5 | 5 | Min spacing, no overlap, between pi1 and ubm | 10.00 | 10.00 | |
| 23 | 6 | 6 | Min spacing between center of ubm and outer edge of the seal ring | 155.00 | 195.00 | |
| 24 | (bump.-.-) | (bump_500.-.-) | Bump balls for WLCSP | |||
| 25 | Function: WLCSP bump balls | |||||
| 26 | 1 | 1 | Min width of bump (for parallel opposite edges) | 261.00 | 310.00 | |
| 27 | 2 | 2 | Min/Max pitch spacing between bump (center to center) | 400.00 | 500.00 | |
| 28 | 2a | 2a | Min/Max pitch spacing between bump (center to center) across the scribe | NC | 400.00 | 500.00 |
| 29 | 3 | 3 | Min spacing between bump and outer edge of the seal ring | 25.00 | 25.00 | |
| 30 | 4 | 4 | Min size of Chip_extent overlapping bump.dg | 750 X 1000 | 1000 X 1000 | |
| 31 | 5 | 5 | Max size of Chip_extent overlapping bump.dg | 6800 X 6800 | 6800 X 6800 |