810 B
810 B
| 1 | Layer / Design rule | CD | space | Comment | ||
|---|---|---|---|---|---|---|
| 2 | Enclosure of fuses by polyimide | 12 | PimFuseEnc | |||
| 3 | Enclosure of bondpad by polyimide (YUY-165) | 0.5 | PimPadEnc | |||
| 4 | Enclosure of pad:dg by PBO inside inductor capture pad, with DECA online monitoring | 4.5 | PBOPadEnc | |||
| 5 | Enclosure of pad:dg by PBO per standard DECA rules | 7.5 | PBOPadEncDECA | |||
| 6 | DECA PBO drawn-to-final process bias per side | 0.5 | PBOProcBiasPerSide | |||
| 7 | Polyimide CD tolerance | 1 | PimCD_tol | |||
| 8 | Min Pim width over pad openings | 87 | PimOverPad_CD | |||
| 9 | Polyimide slope (001-87400) | 5.3 | I_polyimide_slope | |||
| 10 | Enclosure of polyimide by polymer tolerance | 7.7 | Po_po_tol | |||
| 11 | Min/Max enclosure of pad.dg inside M5RDL by pmm | 0 | pmmM5RDLpadEnc | |||
| 12 | Min spacing of pmm to (rdl NOT (pad.dg sized by 0.5)) | 19.16 | pmmRDLspc | |||
| 13 | Enclosure of laser targets in the die by polyimide | 30 | PimLaserEnc |