1.3 KiB
1.3 KiB
| 1 | Name | Description | Flags | Value | Unit |
|---|---|---|---|---|---|
| 2 | (via3.1) | Min and max L and W of via3 (except for rule via3.1a) | AL | 0.200 | µm |
| 3 | (via3.1a) | Two sizes of square via3 allowed inside :drc_tag:`areaid.mt`: 0.200um and 0.800um | AL | ||
| 4 | (via3.2) | Spacing of via3 to via3 | AL | 0.200 | µm |
| 5 | (via3.3) | Only min. square via3s are allowed except die seal ring where via3s are (Via3 CD)*L | 0.2*L | ||
| 6 | (via3.4) | Via3 must be enclosed by Met3 by at least … | AL | 0.060 | µm |
| 7 | (via3.5) | Via3 must be enclosed by Met3 on one of two adjacent sides by at least … | AL | 0.090 | µm |
| 8 | (via3.11) | Min and max L and W of via3 | CU | 0.210 | µm |
| 9 | (via3.12) | Min spacing between via2's | CU | 0.180 | µm |
| 10 | (via3.13) | Via3 must be enclosed by Met3 by at least … | CU | 0.055 | µm |
| 11 | (via3.14) | Min spacing between via3 rows | CU | 0.350 | µm |
| 12 | (via3.irdrop.1) | For 1 <= n <= 2 via3's on the same connector, mcon area pre- and post- Cu conversion must differ by no more than… | CU IR | 0.0 | µm |
| 13 | (via3.irdrop.2) | For 3 <= n <= 15 via3's on the same connector, mcon area pre- and post- Cu conversion must differ by no more than… | CU IR | 0.6 | µm |
| 14 | (via3.irdrop.3) | For 16 <= n <= 30 via3's on the same connector, mcon area pre- and post- Cu conversion must differ by no more than… | CU IR | 0.8 | µm |
| 15 | (via3.irdrop.4) | For n > 30 via3's on the same connector, mcon area pre- and post- Cu conversion must differ by no more than… | CU IR | 0.9 | µm |