14 lines
810 B
Plaintext
14 lines
810 B
Plaintext
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Layer / Design rule,CD,,space,,Comment
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Enclosure of fuses by polyimide,12,,,,PimFuseEnc
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Enclosure of bondpad by polyimide (YUY-165),0.5,,,,PimPadEnc
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"Enclosure of pad:dg by PBO inside inductor capture pad, with DECA online monitoring",4.5,,,,PBOPadEnc
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Enclosure of pad:dg by PBO per standard DECA rules,7.5,,,,PBOPadEncDECA
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DECA PBO drawn-to-final process bias per side,0.5,,,,PBOProcBiasPerSide
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Polyimide CD tolerance,1,,,,PimCD_tol
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Min Pim width over pad openings,87,,,,PimOverPad_CD
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Polyimide slope (001-87400),,5.3,,,I_polyimide_slope
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Enclosure of polyimide by polymer tolerance,,7.7,,,Po_po_tol
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Min/Max enclosure of pad.dg inside M5RDL by pmm,0,,,,pmmM5RDLpadEnc
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Min spacing of pmm to (rdl NOT (pad.dg sized by 0.5)),,,19.16,,pmmRDLspc
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Enclosure of laser targets in the die by polyimide,30,,,,PimLaserEnc
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