3 Commits

Author	SHA1	Message	Date
R. Timothy Edwards	c363d52ccc	Corrected the documented solder bump dimension in the diagram (#133) ... die_pads.svg from 250um to 350um diameter.	2022-09-29 07:10:53 -07:00
jeffdi	ee7eded766	add documentation	2021-12-17 11:55:08 -08:00
jeffdi	e5cf492e0a	add documentation	2021-12-16 17:51:16 -08:00