Corrected the documented solder bump dimension in the diagram (#133)

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die_pads.svg from 250um to 350um diameter.

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R. Timothy Edwards 2022-09-29 10:10:53 -04:00 committed by GitHub

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commit c363d52ccc

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1 changed files with 981 additions and 10102 deletions

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docs/source/_static/die_pads.svg

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Side by Side Swipe Overlay Before Width:  |  Height:  |  Size: 258 KiB After Width:  |  Height:  |  Size: 80 KiB