Name,Defining algorithm,,,Used in … AR_met2_A,Net Area Ratio of met2 not connected to via and of via2 >=0.05 [Equation: (AREA(via2))/(2 * AREA(met2NotConnVia) + PERIMETER(met2NotConnVia) * 0.35)],,,Rules AR_met2_B,"Net Area Ratio of met2GroundOrFloat, via, and via2 <=0.032 [Equation: (AREA(via2))/(2 * AREA(met2GroundOrFloatVia) + PERIMETER(met2GroundOrFloatVia) * 0.35)]",,,Rules bondPad,pad:dg OUTSIDE areaid:ft,,,Rules bottom_plate,(capm:dg AND met2:dg) sized by capm.3; Exclude all capm sharing same metal2 plate,,,Rules Capacitor,Capm enclosing at least one via2,,,Rules Chip_extent,Holes (areaid:sl ) OR areaid.sl,,,Rules Diecut_pmm,areaid.dt NOT (cfom.wp OR cp1m.wp OR cmm1.wp OR cmm2.wp),,,Rules drain_diffusion,(diff NOT poly in nwell or pwell) not abutting tap in the same well or abutting tap in the opposite well,,,Rules dummy_capacitor,Capm not overlapping via2,,,Rules dummy_poly,"poly overlapping text ""dummy_poly"" (written using text.dg)",,,Rules ESD_nwell_tap,"n+ tap coincident with nwell such that n+ tap and nwell are completely surrounded by and abutting n+ diff on all edges, within areaid:ed ",,,Rules fomDmy_keepout_1, (diff.dg OR tap.dg OR poly.dg OR pwell resistor OR pad OR cfom.dg OR cfom.mk OR PhotoArray OR cp1m.mk),,,Rules floating_met*,met*.dg not connected to diffusion or tap through met(*+1) or met(*-1) and their respecitve vias and contacts,,,Rules fom_waffles,"fom.mk with dimensions (um x um): 0.5 x 0.5, 1.5 x 1.5, 2.5 x 2.5 and 4.08 x 4.08",,,Rules gated_npn,cell name: s8rf_npn_1x1_2p0_HV,,,Rules huge_metX,Metal X geometry wider and longer than 3.000um,,,Rules hugePad,pad.mk with width > 100um,,,Rules iso_pwell,(NOT nwell) AND dnwell,,,Rules isolated_tap,tap that does not abut diff,,,Rules laser_target,cell *lazX_* and *lazY_* OUTSIDE areaid:ft,,,Rules LVnwell,nwell NOT hvi,,,Rules LVTN_Gate,Gate overlapping lvtn,,,Rules met2GroundOrFloat,met2 connected to ptap or met2 not connected to difftap\n,,,Rules met2GroundOrFloatVia,met2GroundOrFloat interacting with via2 >2,,,Rules N+_diff,Diff NOT Nwell,,,Rules N+_tap,Tap AND Nwell,,,Rules nsdmHoles,Hole( nsdm ),,,Rules NSM_keepout,nsm.dg OR nsm.mk,,,Rules nwell_all,nwell OR extension of cnwm beyond nwell edge straddling de_nFet_source by cnwm.3f (45 degree edges are retained for the NVHV device nwell); Rule cnwm.3f applies only to GSMC flows,,,Rules P+_diff,Diff AND Nwell,,,Rules P+_tap,Tap NOT Nwell,,,Rules Pattern_density,(diff_tap area) / PD window (as specified in the rule section),,,Rules photoDiode,deep nwell overlapping areaid.po. Die+frame utility will use the mask data of dnwell in the implementation of this definition,,,Rules poly_licon1,Any licon1 that does not overlap ((diff or tap) NOT poly),,,Rules poly_waffles,"p1m.mk with dimensions (um x um): 0.48 x 0.48, 0.54 x 0.54 and 0.72 x 0.72",,,Rules prec_resistor,rpm AND (poly overlapping poly.rs) AND psdm,,,Rules prec_resistor_terminal,prec_resistor AND li,,,Rules psdmHoles,Hole( psdm ),,,Rules pwell,NOT nwell (default substrate area),,,Rules pwres_terminal,P+tap abutting pwell.rs,,,Rules pnp_emitter,diff AND pnp.dg AND psdm,,,Rules routing_terminal,metX.pin sized inside of metX.drawing by 1/2 * metalX min width; Similar defintion applies to Li1 layer,,,Rules scribe_line,areaid:ft NOT areaid:dt,,,Rules slotted_licon,licon1.dg of size 0.19um x 2.0um,,,Rules slotted_licon_edge1,2.0um edge of the slotted_licon,,,Rules source_diffusion,(diff NOT poly in nwell or pwell) abutting tap in same well,,,Rules tap_licon,Tap AND Licon1,,,Rules tap_notPoly,tap NOT poly,,,Rules top_indmMetal,met3 for S8D*,,,Rules top_metal,met3.dg OR mm3.mk (for S8T*/SP8TEE-5R); met3.dg OR indm.mk (for S8D*); met4.dg OR mm4.mk (for SP8Q/S8Q*); met5.dg OR mm5.mk (for SP8P*/S8P*),,,Rules top_padVia,Via2 for S8D*,,,Rules top_plate,capm:dg,,,Rules Var_channel,poly AND tap AND (nwell NOT hvi) NOT areaid.ce,,,Rules VaracTap,Tap overlapping Var_channel,,,Rules vpp_with_noLi,vpp with cell names: FIXME,,,Rules vpp_with_Met3Shield,vpp with cell names: FIXME,,,Rules vpp_with_LiShield,vpp with cell names: FIXME,,,Rules vpp_over_MOSCAP,"vpp with cell names: FIXME when over nhvnative W/L=10x4, FIXME when over phv/pshort/phighvt/plowvt W/L=5x4",,,Rules vpp_with_Met5PolyShield,vpp with cell names: FIXME,,,Rules vpp_with_Met5,vpp with cell names: FIXME,,,Rules cp1m_HV,cp1m AND Hvi,,,Rules (HV) de_nFet_drain,((isolated tap) AND areaid.en) overlapping nwell,,,Rules (HV) de_nFET_gate,deFET_gate overlapping (diff NOT dnwell),,,Rules (HV) de_nFet_source,(diff AND areaid.en) overlapping de_nFET_gate,,,Rules (HV) de_pFet_drain,((isolated tap) AND areaid.en) not overlapping nwell,,,Rules (HV) de_pFET_gate,deFET_gate overlapping (diff AND dnwell),,,Rules (HV) de_pFet_source,(diff AND areaid.en) overlapping de_pFET_gate,,,Rules (HV) deFET_gate,"(poly AND areaid.en) not overlapping pwm ; For CAD flows that do not have pwm layer, it is (poly AND areaid.en)",,,Rules (HV) Hdiff,Diffusion AND Hvi,,,Rules (HV) Hgate,Hpoly AND diff,,,Rules (HV) Hnwell,Nwell AND Hvi,,,Rules (HV) Hpoly,Poly AND Hvi,,,Rules (HV) Htap,Tap AND Hvi,,,Rules (HV) hv_source/drain,= (diff andNot poly) that overlaps diff.hv,,,Rules (HV) hvFET_gate,= FET_gate butting hv_source/drain,,,Rules (HV) hvPoly,= poly electrically connected to hv_source/drain,,,Rules (HV) HV_nwell,(nwell AND hvi) OR (nwell overlapping areaid.hl),,,Rules (HV) stack_hv_lv_diff,(diff And Hvi NOT nwell) abutting (diff NOT nwell),,,Rules (HV) SHVdiff,Diff And shvi,,,Rules (SHV) SHVGate,SHVPoly AND diff,,,Rules (SHV) SHVPoly,Poly OVERLAP shvi:dg,,,Rules (SHV) SHVSourceDrain,Diff And shvi NOT poly NOT diff:rs,,,Rules (SHV) VHVdiff,Diff And vhvi,,,Rules (VHV) VHVGate,VHVPoly AND diff,,,Rules (VHV) VHVPoly,Poly OVERLAP vhvi:dg,,,Rules (VHV) VHVSourceDrain,(Diff AND tap) And vhvi NOT poly NOT diff:rs,,,Rules (VHV) background,"Area where waffling grid is defined, sized to avoid waffle shift between runs",,,Waffles die,Holes (areaid:sl ),,,Waffles frame,( areaid.ft SIZE by -(max of s.2e/h)) NOT (OR areaid.dt SEALIDandHole),,,Waffles inductor_metal,(inductor:dg AND (met1 OR met2 OR met3)) size by 10 um [For all flows except S8PIR-10R]\ninductor.dg [for the S8PIR-10R flow],,,Waffles mm*_slot,mm* slots are defined as empty holes in metal that are located in (areaid.cr OR areaid.cd),,,Waffles nwellDnwellHoles,(inner HOLES of nwellAndDnwell). Die+frame utility will use the mask data of nwell and dnwell in the implementation of this definition,,,Waffles photoArray,(OR nwellAndDnwell nwellDnwellHoles) enclosing photoDiode. Die+frame utility will use the mask data of nwell and dnwell in the implementation of this definition,,,Waffles gate,poly AND diff,,,"pfet, nfet (LVS)" nfet,Gate NOT nwell,,,"pfet, nfet (LVS)" pfet,Gate AND nwell,,,"pfet, nfet (LVS)" nDiode,Ndiff AND DiodeID,,,Diodes (LVS) Pdiff,diff AND nwell,,,Diodes (LVS) pDiode,Pdiff AND DiodeID,,,Diodes (LVS) diff_hole,Hole( diff ),,,ESD (LVS) diff_tap_nwell,tap_nwell INSIDE diff_hole,,,ESD (LVS) esd_diff_tap_nwell,ESDID AND diff_tap_nwell,,,ESD (LVS) Ndiff,diff NOT nwell,,,ESD (LVS) tap_nwell,tap INSIDE nwell,,,ESD (LVS) ESD_diffusion,A+B31ny diffusion or ESD_nwell_tap connected directly or through a resistor to a Pad or to Vss/Vcc that is covered by areaid.ed and located within a double tap guardrings.,,,Latch up rules ESD_cascode_diffusion,Diffusion covered by areaid.ed between two minimum spaced poly gates and located within a pair of double tap guardrings. (There should be no licons on the diffusion.),,,Latch up rules ESD_diode,Any nwell (other than ESD_nwell_tap ) covered by areaid.ed and areaid.de that does not contain poly,,,Latch up rules ESD_FET,(any Pdiff covered by areaid:ed within a double tap guardrings) Or\nESD_NFET,,,Latch up rules ESD_NFET,(any Ndiff covered by areaid:ed abutting ESD_nwell_tap) Or (any Ndiff covered by areaid:ed abutting gate within 3.5um of ESD_nwell_tap) Or (any Ndiff abutting ESD_nwell_tap within areaid.ed) a double tap guardrings,,,Latch up rules I/O_or_Output_Pmos,ESD P+ diffusion overlapping poly and overlapping ESD source/drain diffusion connected to I/O or output net,,,Latch up rules I/O_Pmos_w/series_R,ESD PMOS connected to I/O or output net through series resistors,,,Latch up rules met_ESD_resistor,Metal resistor inside areaid:ed,,,Latch up rules Non_Vcc_nwell,Any nwell connected to any bias other than power supply,,,Latch up rules Nwell_area,Is determined using the following steps:\n(a) Grow pdiff by 1.5 mm\n(b) Merge\n(c) And Nwell:dg,,,Latch up rules Pwell_area,Is determined using the following steps:\n(a) Grow ndiff by 1.5 mm\n(b) Merge\n(c) NOT Nwell:dg,,,Latch up rules Series_transistors,Merged diffusion determined by Nwell_area and Pwell_area,,,Latch up rules fuse:dg,"met2:fe for S8D*/S8TM*, met3.fe for S8TEE*/S8TNV/S8Q*/SP8TEE-5R/SP8Q*, met4.fe for S8P*/SP8P*",,,Fuse rules fuse_contact,(fuse_metal overlapping fuse:dg) NOT fuse:dg,,,Fuse rules fuse_metal,"met3 for S8TEE*/S8TNV/S8Q*/SP8TEE-5R/SP8Q*; met2 for S8D*/S8TM*, met4 for S8P*/SP8P*",,,Fuse rules fuse_shield,"Metal line (same metal level as fuse) between fuse and periphery, not overlapping contacts or vias, with specified dimensions",,,Fuse rules non-isolated fuse edge,Long edge of the fuse spaced to Met2/Met3/Met4 less than a specified amount,,,Fuse rules single_fuses,Fuses without neighboring fuses within specified distance,,,Fuse rules