* New: In cumulus/block.bigvia, add a getBoundingBox() method.
* New: In cumulus/block.configuration.GaugeConf.rpAccess(),
add a vertical strap segment in case the RP is not high enough to
accomodate the potential offset of the contact.
In case of gauge with only two routing layers, if the RP
is vertically accessed, do not put a VIA12 but just a METAL2
contact (there will be *no* turn).
* Change: In cumulus/chip.CoreWire.drawWire(), the wire at *chip level*
going to the pad was shrunk of 3 pitch when *not* in the preferred
routing direction. Removing it as it creates gaps in some cases.
This was likely needed for a specific kind of I/O pad so should
be re-enabled on targeted cases in the future.
* Change: In cumulus/chip.corona.VerticalRail, manage in a smarter way
the conflicts when a rail is accessed from both sides overlapping
on an Y position. That is, from the supply I/O pads *and* from the
*core* supply lines.
Formerly, we just didn't connect the core power line, which was
a mistake potentially leaving power rails unconnected (it it did
occur on both sides).
Also checks if the conflict really arise, that is, the power lines
are both on top or bottom.
* Change: In cumulus/chip.pads.Side._placePad(), manage I/O pads with
a bottom left corner of abutment box *not* at (0,0). Argh!
* Bug: In cumulus/chip.pads, create the filler pad instances in the
chip, not in the corona.
181b2e1080