add μ-board, pro-micro like xmega board
This commit is contained in:
parent
53a53036f3
commit
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(module DX07B024JJ1R1300 (layer F.Cu) (tedit 5A24E0DC)
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(fp_text reference J1 (at 0 -2.15) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value USB_TYPE_C (at 0 7.7) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_line (start 4.7 6.85) (end 6.7 6.85) (layer F.CrtYd) (width 0.1))
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(fp_line (start -4.7 6.85) (end -6.5 6.85) (layer F.CrtYd) (width 0.1))
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(fp_line (start 4.7 2.6) (end 4.7 6.85) (layer F.CrtYd) (width 0.1))
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(fp_arc (start 4.7 2.1) (end 4.7 1.6) (angle 180) (layer F.CrtYd) (width 0.1))
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(fp_arc (start -4.7 2.1) (end -4.7 1.6) (angle -180) (layer F.CrtYd) (width 0.1))
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(fp_line (start -4.7 2.6) (end -4.7 6.85) (layer F.CrtYd) (width 0.1))
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(fp_line (start -4.7 1.6) (end 4.7 1.6) (layer F.CrtYd) (width 0.1))
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(pad 0 thru_hole oval (at 5.85 5.3) (size 1.1 2.75) (drill oval 0.7 1.5 (offset 0 -0.325)) (layers *.Cu *.Mask))
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(pad B12 smd rect (at -2.875 0.9) (size 0.27 0.8) (layers F.Cu F.Paste F.Mask))
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(pad 0 thru_hole oval (at 4.32 0) (size 1.2 2.3) (drill oval 0.6 1.9) (layers *.Cu *.Mask))
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(pad 0 thru_hole oval (at -3.97 0.6) (size 1.4 1.1) (drill oval 1.2 0.7) (layers *.Cu *.Mask))
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(pad 0 thru_hole oval (at 4 0.6) (size 1.4 1.1) (drill oval 1.2 0.7) (layers *.Cu *.Mask))
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(pad A1 smd rect (at -2.625 -0.7) (size 0.27 0.9) (layers F.Cu F.Paste F.Mask))
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(pad 0 thru_hole oval (at -4.32 0) (size 1.2 2.3) (drill oval 0.6 1.9) (layers *.Cu *.Mask))
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(pad 0 thru_hole oval (at -5.85 5.3) (size 1.1 2.75) (drill oval 0.7 1.5 (offset 0 -0.325)) (layers *.Cu *.Mask))
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(pad A2 smd rect (at -2.125 -0.7) (size 0.27 0.9) (layers F.Cu F.Paste F.Mask))
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(pad A3 smd rect (at -1.625 -0.7) (size 0.27 0.9) (layers F.Cu F.Paste F.Mask))
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(pad A4 smd rect (at -1.125 -0.7) (size 0.27 0.9) (layers F.Cu F.Paste F.Mask))
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(pad A5 smd rect (at -0.625 -0.7) (size 0.27 0.9) (layers F.Cu F.Paste F.Mask))
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(pad A6 smd rect (at -0.125 -0.7) (size 0.27 0.9) (layers F.Cu F.Paste F.Mask))
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(pad A7 smd rect (at 0.375 -0.7) (size 0.27 0.9) (layers F.Cu F.Paste F.Mask))
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(pad A8 smd rect (at 0.875 -0.7) (size 0.27 0.9) (layers F.Cu F.Paste F.Mask))
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(pad A9 smd rect (at 1.375 -0.7) (size 0.27 0.9) (layers F.Cu F.Paste F.Mask))
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(pad A10 smd rect (at 1.875 -0.7) (size 0.27 0.9) (layers F.Cu F.Paste F.Mask))
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(pad A11 smd rect (at 2.375 -0.7) (size 0.27 0.9) (layers F.Cu F.Paste F.Mask))
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(pad A12 smd rect (at 2.875 -0.7) (size 0.27 0.9) (layers F.Cu F.Paste F.Mask))
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(pad B11 smd rect (at -2.375 0.9) (size 0.27 0.8) (layers F.Cu F.Paste F.Mask))
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(pad B10 smd rect (at -1.875 0.9) (size 0.27 0.8) (layers F.Cu F.Paste F.Mask))
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(pad B9 smd rect (at -1.375 0.9) (size 0.27 0.8) (layers F.Cu F.Paste F.Mask))
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(pad B8 smd rect (at -0.875 0.9) (size 0.27 0.8) (layers F.Cu F.Paste F.Mask))
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(pad B7 smd rect (at -0.375 0.9) (size 0.27 0.8) (layers F.Cu F.Paste F.Mask))
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(pad B6 smd rect (at 0.125 0.9) (size 0.27 0.8) (layers F.Cu F.Paste F.Mask))
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(pad B5 smd rect (at 0.625 0.9) (size 0.27 0.8) (layers F.Cu F.Paste F.Mask))
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(pad B4 smd rect (at 1.125 0.9) (size 0.27 0.8) (layers F.Cu F.Paste F.Mask))
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(pad B3 smd rect (at 1.625 0.9) (size 0.27 0.8) (layers F.Cu F.Paste F.Mask))
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(pad B2 smd rect (at 2.125 0.9) (size 0.27 0.8) (layers F.Cu F.Paste F.Mask))
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(pad B1 smd rect (at 2.625 0.9) (size 0.27 0.8) (layers F.Cu F.Paste F.Mask))
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)
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@ -0,0 +1,16 @@
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(module StitchVia_2x2_0.3mm (layer F.Cu) (tedit 5A265FD6)
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(fp_text reference REF** (at 0 -1) (layer Cmts.User) hide
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value StitchVia_0.3mm (at 0 -2) (layer F.Fab) hide
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(pad 1 thru_hole circle (at -0.5 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
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(zone_connect 2) (thermal_width -1) (thermal_gap -1))
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(pad 1 thru_hole circle (at 0.5 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
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(zone_connect 2) (thermal_width -1) (thermal_gap -1))
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(pad 1 thru_hole circle (at -0.5 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
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(zone_connect 2) (thermal_width -1) (thermal_gap -1))
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(pad 1 thru_hole circle (at 0.5 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask)
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(zone_connect 2) (thermal_width -1) (thermal_gap -1))
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)
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@ -0,0 +1,12 @@
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(module TestPoint_Pad_1.0x1.0mm (layer F.Cu) (tedit 5A2660AB)
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(descr "SMD rectangular pad as test Point, square 1.0mm side length")
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(tags "test point SMD pad rectangle square")
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(attr virtual)
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(fp_text reference REF** (at 0 -1.448) (layer F.SilkS) hide
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value TestPoint_Pad_1.0x1.0mm (at 0 1.55) (layer F.Fab) hide
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(pad 1 smd rect (at 0 0) (size 1 1) (layers F.Cu F.Mask))
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)
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@ -0,0 +1,61 @@
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(module USB_C_Receptacle_Amphenol_12401548E4-2A (layer F.Cu) (tedit 5A142044)
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(descr "USB TYPE C, RA RCPT PCB, Hybrid, https://www.amphenolcanada.com/StockAvailabilityPrice.aspx?From=&PartNum=12401548E4%7e2A")
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(tags "USB C Type-C Receptacle Hybrid")
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(attr smd)
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(fp_text reference REF** (at 0 -6.36) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value USB_C_Receptacle_Amphenol_12401548E4-2A (at 0 6.14) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.1)))
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)
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(fp_line (start -5.39 5.73) (end -5.39 -5.87) (layer F.CrtYd) (width 0.05))
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(fp_line (start 5.39 5.73) (end -5.39 5.73) (layer F.CrtYd) (width 0.05))
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(fp_line (start 5.39 -5.87) (end 5.39 5.73) (layer F.CrtYd) (width 0.05))
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(fp_line (start -5.39 -5.87) (end 5.39 -5.87) (layer F.CrtYd) (width 0.05))
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(fp_line (start 4.6 5.23) (end 4.6 -5.22) (layer F.Fab) (width 0.1))
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(fp_line (start -4.6 5.23) (end 4.6 5.23) (layer F.Fab) (width 0.1))
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(fp_line (start 3.25 -5.37) (end 4.75 -5.37) (layer F.SilkS) (width 0.12))
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(fp_line (start 4.75 -5.37) (end 4.75 1.89) (layer F.SilkS) (width 0.12))
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(fp_line (start -4.75 -5.37) (end -4.75 1.89) (layer F.SilkS) (width 0.12))
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(fp_line (start -4.75 -5.37) (end -3.25 -5.37) (layer F.SilkS) (width 0.12))
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(fp_line (start -4.6 -5.22) (end 4.6 -5.22) (layer F.Fab) (width 0.1))
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(fp_line (start -4.6 5.23) (end -4.6 -5.22) (layer F.Fab) (width 0.1))
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(pad S1 thru_hole oval (at -4.13 -3.11) (size 0.8 1.4) (drill oval 0.5 1.1) (layers *.Cu *.Mask))
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(pad A1 smd rect (at -2.75 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A2 smd rect (at -2.25 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A3 smd rect (at -1.75 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A4 smd rect (at -1.25 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A5 smd rect (at -0.75 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A6 smd rect (at -0.25 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A7 smd rect (at 0.25 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A12 smd rect (at 2.75 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A10 smd rect (at 1.75 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A9 smd rect (at 1.25 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A8 smd rect (at 0.75 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A11 smd rect (at 2.25 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad S1 thru_hole oval (at 4.13 -3.11) (size 0.8 1.4) (drill oval 0.5 1.1) (layers *.Cu *.Mask))
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(pad S1 thru_hole oval (at 4.49 2.84) (size 0.8 1.4) (drill oval 0.5 1.1) (layers *.Cu *.Mask))
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(pad S1 thru_hole oval (at -4.49 2.84) (size 0.8 1.4) (drill oval 0.5 1.1) (layers *.Cu *.Mask))
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(pad "" np_thru_hole oval (at 3.6 -4.36) (size 0.95 0.65) (drill oval 0.95 0.65) (layers *.Cu *.Mask))
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(pad "" np_thru_hole circle (at -3.6 -4.36) (size 0.65 0.65) (drill 0.65) (layers *.Cu *.Mask))
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(pad B1 thru_hole circle (at 2.8 -3.71) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B4 thru_hole circle (at 1.2 -3.71) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B6 thru_hole circle (at 0.4 -3.71) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B7 thru_hole circle (at -0.4 -3.71) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B9 thru_hole circle (at -1.2 -3.71) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B12 thru_hole circle (at -2.8 -3.71) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B2 thru_hole circle (at 2.4 -3.01) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B3 thru_hole circle (at 1.6 -3.01) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B5 thru_hole circle (at 0.8 -3.01) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B8 thru_hole circle (at -0.8 -3.01) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B10 thru_hole circle (at -1.6 -3.01) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B11 thru_hole circle (at -2.4 -3.01) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(model ${KISYS3DMOD}/Conn_USB.3dshapes/USB_C_Receptacle_Amphenol_12401548E4-2A.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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@ -0,0 +1,63 @@
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(module USB_C_Receptacle_Amphenol_12401548E4-2A_CircularHoles (layer F.Cu) (tedit 5A142044)
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(descr "USB TYPE C, RA RCPT PCB, Hybrid, https://www.amphenolcanada.com/StockAvailabilityPrice.aspx?From=&PartNum=12401548E4%7e2A")
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(tags "USB C Type-C Receptacle Hybrid")
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(attr smd)
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(fp_text reference REF** (at 0 -6.36) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value USB_C_Receptacle_Amphenol_12401548E4-2A_CircularHoles (at 0 6.14) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.1)))
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)
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(fp_line (start -5.69 5.73) (end -5.69 -5.87) (layer F.CrtYd) (width 0.05))
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(fp_line (start 5.69 5.73) (end -5.69 5.73) (layer F.CrtYd) (width 0.05))
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(fp_line (start 5.69 -5.87) (end 5.69 5.73) (layer F.CrtYd) (width 0.05))
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(fp_line (start -5.69 -5.87) (end 5.69 -5.87) (layer F.CrtYd) (width 0.05))
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(fp_line (start 4.6 5.23) (end 4.6 -5.22) (layer F.Fab) (width 0.1))
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(fp_line (start -4.6 5.23) (end 4.6 5.23) (layer F.Fab) (width 0.1))
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(fp_line (start 3.25 -5.37) (end 4.75 -5.37) (layer F.SilkS) (width 0.12))
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(fp_line (start 4.75 -5.37) (end 4.75 -3.85) (layer F.SilkS) (width 0.12))
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(fp_line (start -4.75 -2.35) (end -4.75 1.89) (layer F.SilkS) (width 0.12))
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(fp_line (start -4.75 -5.37) (end -3.25 -5.37) (layer F.SilkS) (width 0.12))
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(fp_line (start -4.6 -5.22) (end 4.6 -5.22) (layer F.Fab) (width 0.1))
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(fp_line (start -4.6 5.23) (end -4.6 -5.22) (layer F.Fab) (width 0.1))
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(fp_line (start 4.75 -2.35) (end 4.75 1.89) (layer F.SilkS) (width 0.12))
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(fp_line (start -4.75 -5.37) (end -4.75 -3.85) (layer F.SilkS) (width 0.12))
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(pad S1 thru_hole circle (at -4.13 -3.11) (size 1.4 1.4) (drill 1.1) (layers *.Cu *.Mask))
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(pad A1 smd rect (at -2.75 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A2 smd rect (at -2.25 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A3 smd rect (at -1.75 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A4 smd rect (at -1.25 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A5 smd rect (at -0.75 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A6 smd rect (at -0.25 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A7 smd rect (at 0.25 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A12 smd rect (at 2.75 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A10 smd rect (at 1.75 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A9 smd rect (at 1.25 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A8 smd rect (at 0.75 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad A11 smd rect (at 2.25 -5.02) (size 0.3 0.7) (layers F.Cu F.Paste F.Mask))
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(pad S1 thru_hole circle (at 4.13 -3.11) (size 1.4 1.4) (drill 1.1) (layers *.Cu *.Mask))
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(pad S1 thru_hole circle (at 4.49 2.84) (size 1.4 1.4) (drill 1.1) (layers *.Cu *.Mask))
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(pad S1 thru_hole circle (at -4.49 2.84) (size 1.4 1.4) (drill 1.1) (layers *.Cu *.Mask))
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(pad "" np_thru_hole circle (at 3.6 -4.36) (size 0.95 0.95) (drill 0.95) (layers *.Cu *.Mask))
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(pad "" np_thru_hole circle (at -3.6 -4.36) (size 0.65 0.65) (drill 0.65) (layers *.Cu *.Mask))
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(pad B1 thru_hole circle (at 2.8 -3.71) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B4 thru_hole circle (at 1.2 -3.71) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B6 thru_hole circle (at 0.4 -3.71) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B7 thru_hole circle (at -0.4 -3.71) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B9 thru_hole circle (at -1.2 -3.71) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B12 thru_hole circle (at -2.8 -3.71) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B2 thru_hole circle (at 2.4 -3.01) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B3 thru_hole circle (at 1.6 -3.01) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B5 thru_hole circle (at 0.8 -3.01) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B8 thru_hole circle (at -0.8 -3.01) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B10 thru_hole circle (at -1.6 -3.01) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(pad B11 thru_hole circle (at -2.4 -3.01) (size 0.65 0.65) (drill 0.4) (layers *.Cu *.Mask))
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(model ${KISYS3DMOD}/Conn_USB.3dshapes/USB_C_Receptacle_Amphenol_12401548E4-2A.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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@ -0,0 +1,27 @@
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(module USB_TypeC_239FC14-00179T-H (layer F.Cu) (tedit 5A254647)
|
||||
(fp_text reference REF** (at 0 -2.25) (layer F.SilkS)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_text value USB_TypeC_239FC14-00179T-H (at 0.02 7.38) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_line (start 4.47 -0.62) (end -4.47 -0.62) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -4.47 -0.62) (end -4.47 6.63) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -4.47 6.63) (end 4.47 6.63) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start 4.47 6.63) (end 4.47 -0.62) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -4.9 6.2) (end 4.9 6.2) (layer F.CrtYd) (width 0.1))
|
||||
(pad S1 thru_hole oval (at 4.32 4.5) (size 1.2 2.1) (drill oval 0.6 1.5) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at -4.32 4.5) (size 1.2 2.1) (drill oval 0.6 1.5) (layers *.Cu *.Mask))
|
||||
(pad A5 smd rect (at -1.25 -0.38) (size 0.25 0.76) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B4 smd rect (at 1.9 -0.38) (size 0.55 0.76) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A4 smd rect (at -1.9 -0.38) (size 0.55 0.76) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B1 smd rect (at 2.7 -0.38) (size 0.55 0.76) (layers F.Cu F.Paste F.Mask))
|
||||
(pad S1 thru_hole oval (at 4.32 0) (size 1.2 2) (drill oval 0.6 1.4) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at -4.32 0) (size 1.2 2) (drill oval 0.6 1.4) (layers *.Cu *.Mask))
|
||||
(pad A1 smd rect (at -2.7 -0.38) (size 0.55 0.76) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A6 smd rect (at -0.75 -0.38) (size 0.25 0.76) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A7 smd rect (at -0.25 -0.38) (size 0.25 0.76) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B7 smd rect (at 0.25 -0.38) (size 0.25 0.76) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B6 smd rect (at 0.75 -0.38) (size 0.25 0.76) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B5 smd rect (at 1.25 -0.38) (size 0.25 0.76) (layers F.Cu F.Paste F.Mask))
|
||||
)
|
|
@ -0,0 +1,35 @@
|
|||
(module USB_TypeC_239FC14-00276T-H (layer F.Cu) (tedit 5A250B5D)
|
||||
(fp_text reference J1 (at 0 -8.225) (layer Cmts.User) hide
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_text value USB_C_Receptacle (at -0.025 0.95) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_circle (center -4.4 -6) (end -4.15 -6) (layer F.CrtYd) (width 0.1))
|
||||
(fp_line (start -4.65 0) (end -6.2 0) (layer F.CrtYd) (width 0.1))
|
||||
(fp_line (start -4.65 0) (end -4.65 -6) (layer F.CrtYd) (width 0.1))
|
||||
(fp_line (start -4.65 -6) (end 4.65 -6) (layer F.CrtYd) (width 0.1))
|
||||
(fp_line (start 4.65 -6) (end 4.65 0) (layer F.CrtYd) (width 0.1))
|
||||
(fp_line (start 4.65 0) (end 6.2 0) (layer F.CrtYd) (width 0.1))
|
||||
(fp_circle (center 4.4 -6) (end 4.65 -6) (layer F.CrtYd) (width 0.1))
|
||||
(pad B4 smd rect (at 1.9 -6.55) (size 0.55 0.9) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A4 smd rect (at -1.9 -6.55) (size 0.55 0.9) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B1 smd rect (at 2.7 -6.55) (size 0.55 0.9) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A1 smd rect (at -2.7 -6.55) (size 0.55 0.9) (layers F.Cu F.Paste F.Mask))
|
||||
(pad S1 smd oval (at 5.575 -2.3) (size 1.3 2.45) (layers F.Cu F.Paste F.Mask))
|
||||
(pad S1 smd rect (at 5.225 -2.3) (size 0.7 2.45) (layers F.Cu F.Paste F.Mask))
|
||||
(pad S1 thru_hole oval (at -5.575 -2.35) (size 1.2 2) (drill oval 0.6 1.5) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at 5.575 -6.2) (size 1.2 2) (drill oval 0.6 1.4) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at 5.575 -2.35) (size 1.2 2) (drill oval 0.6 1.5) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at -5.575 -6.2) (size 1.2 2) (drill oval 0.6 1.4) (layers *.Cu *.Mask))
|
||||
(pad S1 smd oval (at -5.575 -2.3) (size 1.3 2.45) (layers F.Cu F.Paste F.Mask))
|
||||
(pad S1 smd rect (at -5.225 -2.3) (size 0.7 2.45) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A5 smd rect (at -1.25 -6.55) (size 0.25 0.9) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A6 smd rect (at -0.75 -6.55) (size 0.25 0.9) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A7 smd rect (at -0.25 -6.55) (size 0.25 0.9) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B7 smd rect (at 0.25 -6.55) (size 0.25 0.9) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B6 smd rect (at 0.75 -6.55) (size 0.25 0.9) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B5 smd rect (at 1.25 -6.55) (size 0.25 0.9) (layers F.Cu F.Paste F.Mask))
|
||||
(pad "" np_thru_hole circle (at -4.4 -6) (size 0.5 0.5) (drill 0.5) (layers *.Cu *.Mask))
|
||||
(pad "" np_thru_hole circle (at 4.4 -6) (size 0.5 0.5) (drill 0.5) (layers *.Cu *.Mask))
|
||||
)
|
|
@ -0,0 +1,45 @@
|
|||
(module USB_TypeC_DX07B024XJ1 (layer F.Cu) (tedit 5A25D399)
|
||||
(fp_text reference REF** (at 0.01 -2.4) (layer F.SilkS)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_text value USB_TypeC_DX07B024XJ1 (at 0.01 9.65) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_line (start 4.475 6.75) (end 4.475 2) (layer F.CrtYd) (width 0.1))
|
||||
(fp_line (start -4.475 6.75) (end -4.475 2) (layer F.CrtYd) (width 0.1))
|
||||
(fp_line (start -4.475 2) (end 4.475 2) (layer F.CrtYd) (width 0.1))
|
||||
(fp_line (start 4.475 6.75) (end 6.8 6.75) (layer F.CrtYd) (width 0.1))
|
||||
(fp_line (start -6.8 6.75) (end -4.475 6.75) (layer F.CrtYd) (width 0.1))
|
||||
(pad "" np_thru_hole circle (at 4.475 2.35) (size 0.7 0.7) (drill 0.7) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at 5.8 5.1) (size 1.1 2.4) (drill oval 0.6 1.6 (offset 0 0.15)) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at 4.8 0.875) (size 1.1 1.95) (drill oval 0.6 1.45) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at -5.8 5.1) (size 1.1 2.4) (drill oval 0.6 1.6 (offset 0 0.15)) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at -4.8 0.875) (size 1.1 1.95) (drill oval 0.6 1.45) (layers *.Cu *.Mask))
|
||||
(pad B2 thru_hole circle (at 2.4 1.35) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad "" np_thru_hole oval (at 3.6 0) (size 0.95 0.75) (drill oval 0.95 0.75) (layers *.Cu *.Mask))
|
||||
(pad A1 smd rect (at -2.75 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B1 thru_hole circle (at 2.8 0.55) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad "" np_thru_hole circle (at -3.6 0) (size 0.75 0.75) (drill 0.75) (layers *.Cu *.Mask))
|
||||
(pad A2 smd rect (at -2.25 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A3 smd rect (at -1.75 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A4 smd rect (at -1.25 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A5 smd rect (at -0.75 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A6 smd rect (at -0.25 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A7 smd rect (at 0.25 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A8 smd rect (at 0.75 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A9 smd rect (at 1.25 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A10 smd rect (at 1.75 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A11 smd rect (at 2.25 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A12 smd rect (at 2.75 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B3 thru_hole circle (at 1.6 1.35) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B5 thru_hole circle (at 0.8 1.35) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B7 thru_hole circle (at -0.4 0.55) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B9 thru_hole circle (at -1.35 0.55) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B11 thru_hole circle (at -2.4 1.35) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B4 thru_hole circle (at 1.35 0.55) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B6 thru_hole circle (at 0.4 0.55) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B8 thru_hole circle (at -0.8 1.35) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B10 thru_hole circle (at -1.6 1.35) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B12 thru_hole circle (at -2.8 0.55) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad "" np_thru_hole circle (at -4.475 2.35) (size 0.7 0.7) (drill 0.7) (layers *.Cu *.Mask))
|
||||
)
|
|
@ -0,0 +1,39 @@
|
|||
(module USB_TypeC_DX07S024XJ1 (layer F.Cu) (tedit 5A25CE74)
|
||||
(fp_text reference REF** (at 0.01 -2.4) (layer F.SilkS)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_text value USB_TypeC_DX07S024XJ1 (at 0 7.41) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_line (start -5 6.05) (end 5 6.05) (layer F.CrtYd) (width 0.1))
|
||||
(pad S1 thru_hole oval (at -4.6 4.4) (size 1.1 2.1) (drill oval 0.6 1.6) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at -4.6 1.4) (size 1.1 2.1) (drill oval 0.6 1.6) (layers *.Cu *.Mask))
|
||||
(pad B2 thru_hole circle (at 2.4 1.35) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad "" np_thru_hole oval (at 3.6 0) (size 0.95 0.75) (drill oval 0.95 0.75) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at 4.6 4.4) (size 1.1 2.1) (drill oval 0.6 1.6) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at 4.6 1.4) (size 1.1 2.1) (drill oval 0.6 1.6) (layers *.Cu *.Mask))
|
||||
(pad A1 smd rect (at -2.75 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B1 thru_hole circle (at 2.8 0.65) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad "" np_thru_hole circle (at -3.6 0) (size 0.75 0.75) (drill 0.75) (layers *.Cu *.Mask))
|
||||
(pad A2 smd rect (at -2.25 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A3 smd rect (at -1.75 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A4 smd rect (at -1.25 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A5 smd rect (at -0.75 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A6 smd rect (at -0.25 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A7 smd rect (at 0.25 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A8 smd rect (at 0.75 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A9 smd rect (at 1.25 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A10 smd rect (at 1.75 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A11 smd rect (at 2.25 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A12 smd rect (at 2.75 -0.66) (size 0.3 1.1) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B3 thru_hole circle (at 1.6 1.35) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B5 thru_hole circle (at 0.8 1.35) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B7 thru_hole circle (at -0.4 0.65) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B9 thru_hole circle (at -1.35 0.65) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B11 thru_hole circle (at -2.4 1.35) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B4 thru_hole circle (at 1.35 0.65) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B6 thru_hole circle (at 0.4 0.65) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B8 thru_hole circle (at -0.8 1.35) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B10 thru_hole circle (at -1.6 1.35) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B12 thru_hole circle (at -2.8 0.65) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
)
|
|
@ -0,0 +1,51 @@
|
|||
(module USB_TypeC_Hirose_CX70M-24P1 (layer F.Cu) (tedit 5A26060D)
|
||||
(descr "https://www.hirose.com/product/en/download_file/key_name/CX70M-24P1/category/Drawing%20(2D)/doc_file_id/141189/?file_category_id=6&item_id=04800304000&is_series=")
|
||||
(tags "USB, Type-C")
|
||||
(fp_text reference REF** (at -0.44 -10.33) (layer F.SilkS)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_text value USB_TypeC_Hirose_CX70M-24P1 (at -0.1 1) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_line (start -4.67 -6.65) (end 4.67 -6.65) (layer F.CrtYd) (width 0.1))
|
||||
(fp_line (start 6.2 0) (end 4.67 0) (layer F.CrtYd) (width 0.1))
|
||||
(fp_line (start 4.67 0) (end 4.67 -6.65) (layer F.CrtYd) (width 0.1))
|
||||
(fp_line (start -4.67 0) (end -4.67 -6.65) (layer F.CrtYd) (width 0.1))
|
||||
(fp_line (start -6.2 0) (end -4.67 0) (layer F.CrtYd) (width 0.1))
|
||||
(pad "" np_thru_hole circle (at 4.67 -6.15) (size 1 1) (drill 1) (layers *.Cu *.Mask))
|
||||
(pad S1 smd rect (at 3.915 -8.325) (size 0.46 0.9) (layers F.Cu F.Mask))
|
||||
(pad S1 smd rect (at -3.915 -8.325) (size 0.46 0.9) (layers F.Cu F.Mask))
|
||||
(pad S1 smd rect (at -5.2 -2.6) (size 0.7 2.3) (layers B.Cu B.Mask))
|
||||
(pad S1 smd rect (at 5.2 -2.6) (size 0.7 2.3) (layers B.Cu B.Mask))
|
||||
(pad S1 thru_hole oval (at 5.55 -2.6) (size 1.3 2.3) (drill oval 0.6 1.7) (layers *.Cu *.Mask))
|
||||
(pad S1 smd rect (at 5.2 -2.6) (size 0.7 2.3) (layers F.Cu F.Mask))
|
||||
(pad S1 thru_hole oval (at -5.55 -2.6) (size 1.3 2.3) (drill oval 0.6 1.7) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at -5.55 -7.65) (size 1.2 2.3) (drill oval 0.6 1.7) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at 5.55 -7.65) (size 1.2 2.3) (drill oval 0.6 1.7) (layers *.Cu *.Mask))
|
||||
(pad S1 smd rect (at -5.2 -2.6) (size 0.7 2.3) (layers F.Cu F.Mask))
|
||||
(pad B12 smd rect (at -3.4 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad B11 smd rect (at -3 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad B10 smd rect (at -2.6 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad A1 smd rect (at -2.2 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad A2 smd rect (at -1.8 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad A3 smd rect (at -1.4 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad A4 smd rect (at -1 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad A5 smd rect (at -0.6 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad A6 smd rect (at -0.2 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad A7 smd rect (at 0.2 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad A8 smd rect (at 0.6 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad A9 smd rect (at 1 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad A10 smd rect (at 1.4 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad A11 smd rect (at 1.8 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad A12 smd rect (at 2.2 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad B3 smd rect (at 2.6 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad B2 smd rect (at 3 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad B1 smd rect (at 3.4 -8.325) (size 0.23 0.9) (layers F.Cu F.Mask))
|
||||
(pad B9 thru_hole circle (at -2 -7.2) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B8 thru_hole circle (at -1.2 -7.2) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B7 thru_hole circle (at -0.4 -7.2) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B6 thru_hole circle (at 0.4 -7.2) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B5 thru_hole circle (at 1.2 -7.2) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad B4 thru_hole circle (at 2 -7.2) (size 0.6 0.6) (drill 0.4) (layers *.Cu *.Mask))
|
||||
(pad "" np_thru_hole circle (at -4.67 -6.15) (size 1 1) (drill 1) (layers *.Cu *.Mask))
|
||||
)
|
|
@ -0,0 +1,32 @@
|
|||
(module USB_TypeC_U31F-24SNA0201 locked (layer F.Cu) (tedit 5A262737)
|
||||
(descr http://www.dory-tech.com/UploadFiles/2017/0/2017080810353867631.pdf)
|
||||
(fp_text reference REF** (at 0 -9.1) (layer F.SilkS)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_text value USB_TypeC_U31F-24SNA0201 (at 0.02 1.18) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_line (start 4.47 -7.35) (end -4.47 -7.35) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -4.47 -7.35) (end -4.47 0) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -4.47 0) (end 4.47 0) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start 4.47 0) (end 4.47 -7.35) (layer F.Fab) (width 0.1))
|
||||
(fp_line (start -4.9 -1.45) (end 4.9 -1.45) (layer F.CrtYd) (width 0.1))
|
||||
(pad A6 smd rect (at -0.25 -7.345) (size 0.3 1.15) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B1 smd rect (at 3.2 -7.345) (size 0.6 1.15) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B4 smd rect (at 2.4 -7.345) (size 0.6 1.15) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A4 smd rect (at -2.4 -7.345) (size 0.6 1.15) (layers F.Cu F.Paste F.Mask))
|
||||
(pad S1 thru_hole oval (at -4.32 -6.78) (size 1 2.1) (drill oval 0.6 1.7) (layers *.Cu *.Mask))
|
||||
(pad "" np_thru_hole circle (at -2.89 -6.28) (size 0.65 0.65) (drill 0.65) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at 4.32 -6.78) (size 1 2.1) (drill oval 0.6 1.7) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at -4.32 -2.6) (size 1 1.6) (drill oval 0.6 1.2) (layers *.Cu *.Mask))
|
||||
(pad S1 thru_hole oval (at 4.32 -2.6) (size 1 1.6) (drill oval 0.6 1.2) (layers *.Cu *.Mask))
|
||||
(pad A1 smd rect (at -3.2 -7.345) (size 0.6 1.15) (layers F.Cu F.Paste F.Mask))
|
||||
(pad "" np_thru_hole circle (at 2.89 -6.28) (size 0.65 0.65) (drill 0.65) (layers *.Cu *.Mask))
|
||||
(pad A7 smd rect (at 0.25 -7.345) (size 0.3 1.15) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B6 smd rect (at 0.75 -7.345) (size 0.3 1.15) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A8 smd rect (at 1.25 -7.345) (size 0.3 1.15) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B5 smd rect (at 1.75 -7.345) (size 0.3 1.15) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B7 smd rect (at -0.75 -7.345) (size 0.3 1.15) (layers F.Cu F.Paste F.Mask))
|
||||
(pad A5 smd rect (at -1.25 -7.345) (size 0.3 1.15) (layers F.Cu F.Paste F.Mask))
|
||||
(pad B8 smd rect (at -1.75 -7.345) (size 0.3 1.15) (layers F.Cu F.Paste F.Mask))
|
||||
)
|
|
@ -1,6 +1,6 @@
|
|||
(module svg2mod (layer F.Cu) (tedit 5A23C63E)
|
||||
(module OSHW_Logo (layer F.Cu) (tedit 5A23C63E)
|
||||
(attr virtual)
|
||||
(fp_text reference svg2mod (at 0 -7.55871919225) (layer F.SilkS) hide
|
||||
(fp_text reference OSHW_Logo (at 0 -7.55871919225) (layer F.SilkS) hide
|
||||
(effects (font (size 1.524 1.524) (thickness 0.3048)))
|
||||
)
|
||||
(fp_text value G*** (at 0 7.55871919225) (layer F.SilkS) hide
|
||||
|
@ -62,4 +62,4 @@
|
|||
(layer F.SilkS)
|
||||
(width 0.0)
|
||||
)
|
||||
)
|
||||
)
|
||||
|
|
|
@ -1,6 +1,6 @@
|
|||
(module svg2mod (layer F.Cu) (tedit 5A23C63E)
|
||||
(module OSHW_Logo (layer F.Cu) (tedit 5A23C63E)
|
||||
(attr virtual)
|
||||
(fp_text reference svg2mod (at 0 -3.95014383845) (layer F.SilkS) hide
|
||||
(fp_text reference OSHW_Logo (at 0 -3.95014383845) (layer F.SilkS) hide
|
||||
(effects (font (size 1.524 1.524) (thickness 0.3048)))
|
||||
)
|
||||
(fp_text value G*** (at 0 3.95014383845) (layer F.SilkS) hide
|
||||
|
@ -62,4 +62,4 @@
|
|||
(layer F.SilkS)
|
||||
(width 0.0)
|
||||
)
|
||||
)
|
||||
)
|
||||
|
|
|
@ -1,6 +1,6 @@
|
|||
(module svg2mod (layer F.Cu) (tedit 5A23C63E)
|
||||
(module OSHW_Logo (layer F.Cu) (tedit 5A23C63E)
|
||||
(attr virtual)
|
||||
(fp_text reference svg2mod (at 0 -4.40121575767) (layer F.SilkS) hide
|
||||
(fp_text reference OSHW_Logo (at 0 -4.40121575767) (layer F.SilkS) hide
|
||||
(effects (font (size 1.524 1.524) (thickness 0.3048)))
|
||||
)
|
||||
(fp_text value G*** (at 0 4.40121575767) (layer F.SilkS) hide
|
||||
|
@ -62,4 +62,4 @@
|
|||
(layer F.SilkS)
|
||||
(width 0.0)
|
||||
)
|
||||
)
|
||||
)
|
||||
|
|
|
@ -1,6 +1,6 @@
|
|||
(module svg2mod (layer F.Cu) (tedit 5A23C63E)
|
||||
(module OSHW_Logo (layer F.Cu) (tedit 5A23C63E)
|
||||
(attr virtual)
|
||||
(fp_text reference svg2mod (at 0 -4.8522876769) (layer F.SilkS) hide
|
||||
(fp_text reference OSHW_Logo (at 0 -4.8522876769) (layer F.SilkS) hide
|
||||
(effects (font (size 1.524 1.524) (thickness 0.3048)))
|
||||
)
|
||||
(fp_text value G*** (at 0 4.8522876769) (layer F.SilkS) hide
|
||||
|
@ -62,4 +62,4 @@
|
|||
(layer F.SilkS)
|
||||
(width 0.0)
|
||||
)
|
||||
)
|
||||
)
|
||||
|
|
|
@ -1,6 +1,6 @@
|
|||
(module svg2mod (layer F.Cu) (tedit 5A23C63E)
|
||||
(module OSHW_Logo (layer F.Cu) (tedit 5A23C63E)
|
||||
(attr virtual)
|
||||
(fp_text reference svg2mod (at 0 -5.30335959612) (layer F.SilkS) hide
|
||||
(fp_text reference OSHW_Logo (at 0 -5.30335959612) (layer F.SilkS) hide
|
||||
(effects (font (size 1.524 1.524) (thickness 0.3048)))
|
||||
)
|
||||
(fp_text value G*** (at 0 5.30335959612) (layer F.SilkS) hide
|
||||
|
@ -62,4 +62,4 @@
|
|||
(layer F.SilkS)
|
||||
(width 0.0)
|
||||
)
|
||||
)
|
||||
)
|
||||
|
|
|
@ -1,6 +1,6 @@
|
|||
(module svg2mod (layer F.Cu) (tedit 5A23C63E)
|
||||
(module OSHW_Logo (layer F.Cu) (tedit 5A23C63E)
|
||||
(attr virtual)
|
||||
(fp_text reference svg2mod (at 0 -5.75443151535) (layer F.SilkS) hide
|
||||
(fp_text reference OSHW_Logo (at 0 -5.75443151535) (layer F.SilkS) hide
|
||||
(effects (font (size 1.524 1.524) (thickness 0.3048)))
|
||||
)
|
||||
(fp_text value G*** (at 0 5.75443151535) (layer F.SilkS) hide
|
||||
|
@ -62,4 +62,4 @@
|
|||
(layer F.SilkS)
|
||||
(width 0.0)
|
||||
)
|
||||
)
|
||||
)
|
||||
|
|
|
@ -1,6 +1,6 @@
|
|||
(module svg2mod (layer F.Cu) (tedit 5A23C63E)
|
||||
(module OSHW_Logo (layer F.Cu) (tedit 5A23C63E)
|
||||
(attr virtual)
|
||||
(fp_text reference svg2mod (at 0 -6.20550343457) (layer F.SilkS) hide
|
||||
(fp_text reference OSHW_Logo (at 0 -6.20550343457) (layer F.SilkS) hide
|
||||
(effects (font (size 1.524 1.524) (thickness 0.3048)))
|
||||
)
|
||||
(fp_text value G*** (at 0 6.20550343457) (layer F.SilkS) hide
|
||||
|
@ -62,4 +62,4 @@
|
|||
(layer F.SilkS)
|
||||
(width 0.0)
|
||||
)
|
||||
)
|
||||
)
|
||||
|
|
|
@ -1,6 +1,6 @@
|
|||
(module svg2mod (layer F.Cu) (tedit 5A23C63E)
|
||||
(module OSHW_Logo (layer F.Cu) (tedit 5A23C63E)
|
||||
(attr virtual)
|
||||
(fp_text reference svg2mod (at 0 -6.6565753538) (layer F.SilkS) hide
|
||||
(fp_text reference OSHW_Logo (at 0 -6.6565753538) (layer F.SilkS) hide
|
||||
(effects (font (size 1.524 1.524) (thickness 0.3048)))
|
||||
)
|
||||
(fp_text value G*** (at 0 6.6565753538) (layer F.SilkS) hide
|
||||
|
@ -62,4 +62,4 @@
|
|||
(layer F.SilkS)
|
||||
(width 0.0)
|
||||
)
|
||||
)
|
||||
)
|
||||
|
|
|
@ -1,6 +1,6 @@
|
|||
(module svg2mod (layer F.Cu) (tedit 5A23C63E)
|
||||
(module OSHW_Logo (layer F.Cu) (tedit 5A23C63E)
|
||||
(attr virtual)
|
||||
(fp_text reference svg2mod (at 0 -7.10764727302) (layer F.SilkS) hide
|
||||
(fp_text reference OSHW_Logo (at 0 -7.10764727302) (layer F.SilkS) hide
|
||||
(effects (font (size 1.524 1.524) (thickness 0.3048)))
|
||||
)
|
||||
(fp_text value G*** (at 0 7.10764727302) (layer F.SilkS) hide
|
||||
|
@ -62,4 +62,4 @@
|
|||
(layer F.SilkS)
|
||||
(width 0.0)
|
||||
)
|
||||
)
|
||||
)
|
||||
|
|
|
@ -0,0 +1,110 @@
|
|||
(module QFN-44-1EP_7x7mm_Pitch0.5mm_Alt_Silk locked (layer F.Cu) (tedit 591D78DA)
|
||||
(descr "UK Package; 44-Lead Plastic QFN (7mm x 7mm); (see Linear Technology QFN_44_05-08-1763.pdf)")
|
||||
(tags "QFN 0.5")
|
||||
(attr smd)
|
||||
(fp_text reference U2 (at 4.445 2.921 90) (layer F.SilkS)
|
||||
(effects (font (size 0.8 0.8) (thickness 0.15)))
|
||||
)
|
||||
(fp_text value ATXMEGA16A4U-MH_EPAD (at 0 4.75) (layer F.Fab)
|
||||
(effects (font (size 1 1) (thickness 0.15)))
|
||||
)
|
||||
(fp_line (start -2.9 -3.6) (end -3.6 -3.6) (layer F.SilkS) (width 0.2))
|
||||
(fp_arc (start -3.6 -3.6) (end -3.6 -3.2) (angle 270) (layer F.SilkS) (width 0.2))
|
||||
(fp_line (start -3.6 -3.6) (end -3.6 -2.9) (layer F.SilkS) (width 0.2))
|
||||
(fp_line (start -2.5 -3.5) (end 3.5 -3.5) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start 3.5 -3.5) (end 3.5 3.5) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start 3.5 3.5) (end -3.5 3.5) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start -3.5 3.5) (end -3.5 -2.5) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start -3.5 -2.5) (end -2.5 -3.5) (layer F.Fab) (width 0.15))
|
||||
(fp_line (start -4 -4) (end -4 4) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 4 -4) (end 4 4) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -4 -4) (end 4 -4) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start -4 4) (end 4 4) (layer F.CrtYd) (width 0.05))
|
||||
(fp_line (start 3.625 -3.625) (end 3.625 -2.85) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start -3.625 3.625) (end -3.625 2.85) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start 3.625 3.625) (end 3.625 2.85) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start -3.625 3.625) (end -2.85 3.625) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start 3.625 3.625) (end 2.85 3.625) (layer F.SilkS) (width 0.15))
|
||||
(fp_line (start 3.625 -3.625) (end 2.85 -3.625) (layer F.SilkS) (width 0.15))
|
||||
(pad 1 smd rect (at -3.4 -2.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 2 smd rect (at -3.4 -2) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 3 smd rect (at -3.4 -1.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 4 smd rect (at -3.4 -1) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 5 smd rect (at -3.4 -0.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 6 smd rect (at -3.4 0) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 7 smd rect (at -3.4 0.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 8 smd rect (at -3.4 1) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 9 smd rect (at -3.4 1.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 10 smd rect (at -3.4 2) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 11 smd rect (at -3.4 2.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 12 smd rect (at -2.5 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 13 smd rect (at -2 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 14 smd rect (at -1.5 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 15 smd rect (at -1 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 16 smd rect (at -0.5 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 17 smd rect (at 0 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 18 smd rect (at 0.5 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 19 smd rect (at 1 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 20 smd rect (at 1.5 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 21 smd rect (at 2 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 22 smd rect (at 2.5 3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 23 smd rect (at 3.4 2.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 24 smd rect (at 3.4 2) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 25 smd rect (at 3.4 1.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 26 smd rect (at 3.4 1) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 27 smd rect (at 3.4 0.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 28 smd rect (at 3.4 0) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 29 smd rect (at 3.4 -0.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 30 smd rect (at 3.4 -1) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 31 smd rect (at 3.4 -1.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 32 smd rect (at 3.4 -2) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 33 smd rect (at 3.4 -2.5) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 34 smd rect (at 2.5 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 35 smd rect (at 2 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 36 smd rect (at 1.5 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 37 smd rect (at 1 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 38 smd rect (at 0.5 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 39 smd rect (at 0 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 40 smd rect (at -0.5 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 41 smd rect (at -1 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 42 smd rect (at -1.5 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 43 smd rect (at -2 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 44 smd rect (at -2.5 -3.4 90) (size 0.7 0.25) (layers F.Cu F.Paste F.Mask))
|
||||
(pad 45 smd rect (at 1.93125 1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at 1.93125 0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at 1.93125 -0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at 1.93125 -1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at 0.64375 1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at 0.64375 0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at 0.64375 -0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at 0.64375 -1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at -0.64375 1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at -0.64375 0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at -0.64375 -0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at -0.64375 -1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at -1.93125 1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at -1.93125 0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at -1.93125 -0.64375) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(pad 45 smd rect (at -1.93125 -1.93125) (size 1.2875 1.2875) (layers F.Cu F.Paste F.Mask)
|
||||
(solder_paste_margin_ratio -0.2))
|
||||
(model Housings_DFN_QFN.3dshapes/QFN-44-1EP_7x7mm_Pitch0.5mm.wrl
|
||||
(at (xyz 0 0 0))
|
||||
(scale (xyz 1 1 1))
|
||||
(rotate (xyz 0 0 0))
|
||||
)
|
||||
)
|
|
@ -0,0 +1,9 @@
|
|||
EESchema-DOCLIB Version 2.0
|
||||
#
|
||||
$CMP USB_C_Receptacle
|
||||
D USB Type-C Receptacle connector
|
||||
K usb universal serial bus
|
||||
F http://www.usb.org/developers/docs/usb_31_033017.zip
|
||||
$ENDCMP
|
||||
#
|
||||
#End Doc Library
|
|
@ -0,0 +1,84 @@
|
|||
EESchema-LIBRARY Version 2.3
|
||||
#encoding utf-8
|
||||
#
|
||||
# USB_C_Receptacle
|
||||
#
|
||||
DEF USB_C_Receptacle J 0 40 Y Y 1 F N
|
||||
F0 "J" -400 1450 50 H V L CNN
|
||||
F1 "USB_C_Receptacle" 400 1450 50 H V R CNN
|
||||
F2 "" 150 0 50 H I C CNN
|
||||
F3 "" 150 0 50 H I C CNN
|
||||
$FPLIST
|
||||
USB*C*Receptacle*
|
||||
$ENDFPLIST
|
||||
DRAW
|
||||
T 900 -30 -175 200 0 0 0 SS Italic 1 C C
|
||||
S -210 -1400 -190 -1360 0 0 0 N
|
||||
S -110 -1400 -90 -1360 0 0 0 N
|
||||
S -10 -1400 10 -1360 0 0 0 N
|
||||
S 90 -1400 110 -1360 0 0 0 N
|
||||
S 400 -1290 360 -1310 0 0 0 N
|
||||
S 400 -1190 360 -1210 0 0 0 N
|
||||
S 400 -990 360 -1010 0 0 0 N
|
||||
S 400 -890 360 -910 0 0 0 N
|
||||
S 400 -690 360 -710 0 0 0 N
|
||||
S 400 -590 360 -610 0 0 0 N
|
||||
S 400 -390 360 -410 0 0 0 N
|
||||
S 400 -290 360 -310 0 0 0 N
|
||||
S 400 -90 360 -110 0 0 0 N
|
||||
S 400 10 360 -10 0 0 0 N
|
||||
S 400 210 360 190 0 0 0 N
|
||||
S 400 310 360 290 0 0 0 N
|
||||
S 400 410 360 390 0 0 0 N
|
||||
S 400 510 360 490 0 0 0 N
|
||||
S 400 710 360 690 0 0 0 N
|
||||
S 400 810 360 790 0 0 0 N
|
||||
S 400 1010 360 990 0 0 0 N
|
||||
S 400 1110 360 1090 0 0 0 N
|
||||
S 400 1210 360 1190 0 0 0 N
|
||||
S 400 1310 360 1290 0 0 0 N
|
||||
A -275 -150 25 -1799 -1 0 1 10 N -300 -150 -250 -150
|
||||
A -275 -150 75 -1799 -1 0 1 20 N -350 -150 -200 -150
|
||||
A -275 -150 25 -1799 -1 0 1 10 F -300 -150 -250 -150
|
||||
A -275 150 75 1 1799 0 1 20 N -200 150 -350 150
|
||||
A -275 150 25 1 1799 0 1 10 N -250 150 -300 150
|
||||
A -275 150 25 1 1799 0 1 10 F -250 150 -300 150
|
||||
C -130 175 25 0 1 10 F
|
||||
S -400 1400 400 -1400 0 1 10 f
|
||||
S -300 -150 -250 150 0 1 10 F
|
||||
S 45 200 95 250 0 1 10 F
|
||||
P 2 0 1 20 -350 -150 -350 150 N
|
||||
P 2 0 1 20 -200 150 -200 -150 N
|
||||
P 2 0 1 20 -30 -50 -30 300 N
|
||||
P 3 0 1 20 -30 0 -130 100 -130 150 N
|
||||
P 3 0 1 20 -30 50 70 150 70 200 N
|
||||
P 4 0 1 10 -80 300 -30 400 20 300 -80 300 F
|
||||
X GND A1 -200 -1600 200 U 50 50 1 1 W
|
||||
X GND B1 0 -1600 200 U 50 50 1 1 W
|
||||
X SHIELD S1 -300 -1600 200 U 50 50 1 1 P
|
||||
X TX1+ A2 600 -400 200 L 50 50 1 1 B
|
||||
X TX2+ B2 600 -1000 200 L 50 50 1 1 B
|
||||
X TX1- A3 600 -300 200 L 50 50 1 1 B
|
||||
X TX2- B3 600 -900 200 L 50 50 1 1 B
|
||||
X VBUS A4 600 1300 200 L 50 50 1 1 W
|
||||
X VBUS B4 600 1100 200 L 50 50 1 1 W
|
||||
X CC1 A5 600 -1200 200 L 50 50 1 1 B
|
||||
X CC2 B5 600 -1300 200 L 50 50 1 1 B
|
||||
X D+ A6 600 300 200 L 50 50 1 1 B
|
||||
X D+ B6 600 200 200 L 50 50 1 1 B
|
||||
X D- A7 600 500 200 L 50 50 1 1 B
|
||||
X D- B7 600 400 200 L 50 50 1 1 B
|
||||
X SBU1 A8 600 800 200 L 50 50 1 1 B
|
||||
X SBU2 B8 600 700 200 L 50 50 1 1 B
|
||||
X VBUS A9 600 1200 200 L 50 50 1 1 W
|
||||
X VBUS B9 600 1000 200 L 50 50 1 1 W
|
||||
X RX2- A10 600 -600 200 L 50 50 1 1 B
|
||||
X RX1- B10 600 0 200 L 50 50 1 1 B
|
||||
X RX2+ A11 600 -700 200 L 50 50 1 1 B
|
||||
X RX1+ B11 600 -100 200 L 50 50 1 1 B
|
||||
X GND A12 -100 -1600 200 U 50 50 1 1 W
|
||||
X GND B12 100 -1600 200 U 50 50 1 1 W
|
||||
ENDDRAW
|
||||
ENDDEF
|
||||
#
|
||||
#End Library
|
|
@ -6,6 +6,18 @@ K regulator linear ldo
|
|||
F http://ww1.microchip.com/downloads/en/DeviceDoc/20001826C.pdf
|
||||
$ENDCMP
|
||||
#
|
||||
$CMP MIC5216-3.3BM5
|
||||
D 300mA low dropout linear regulator, shutdown pin, 1.5V fixed positive output, SOT-23-5 package
|
||||
K linear regulator ldo fixed positive
|
||||
F http://www.diodes.com/_files/datasheets/AP131.pdf
|
||||
$ENDCMP
|
||||
#
|
||||
$CMP MIC5219-3.3
|
||||
D 500mA LDO fixed output voltage 3.3V ultra-low-noise, SOT-23-5
|
||||
K linear low dropout Regulator fixed ultra-low-noise
|
||||
F http://ww1.microchip.com/downloads/en/DeviceDoc/mic5216.pdf
|
||||
$ENDCMP
|
||||
#
|
||||
$CMP TPS6102x
|
||||
D Synchronous Boost Converter
|
||||
K TPS61020, TPS61024, TPS61025, TPS61026, TPS61027, TPS61028, TPS61029
|
||||
|
|
|
@ -36,6 +36,27 @@ X PROG 5 -450 -50 200 R 50 50 1 1 I
|
|||
ENDDRAW
|
||||
ENDDEF
|
||||
#
|
||||
# MIC5216-3.3BM5
|
||||
#
|
||||
DEF MIC5216-3.3BM5 U 0 10 Y Y 1 F N
|
||||
F0 "U" -150 225 50 H V C CNN
|
||||
F1 "MIC5216-3.3BM5" 0 225 50 H V L CNN
|
||||
F2 "TO_SOT_Packages_SMD:SOT-23-5" 0 325 50 H I C CNN
|
||||
F3 "" 0 0 50 H I C CNN
|
||||
ALIAS MIC5219-3.3
|
||||
$FPLIST
|
||||
SOT?23*
|
||||
$ENDFPLIST
|
||||
DRAW
|
||||
S -200 175 200 -200 0 1 10 f
|
||||
X IN 1 -300 100 100 R 50 50 1 1 W
|
||||
X GND 2 0 -300 100 U 50 50 1 1 W
|
||||
X EN 3 -300 0 100 R 50 50 1 1 I
|
||||
X FLG 4 300 0 100 L 50 50 1 1 I
|
||||
X OUT 5 300 100 100 L 50 50 1 1 w
|
||||
ENDDRAW
|
||||
ENDDEF
|
||||
#
|
||||
# TLV61224
|
||||
#
|
||||
DEF TLV61224 U 0 40 Y Y 1 F N
|
||||
|
|
|
@ -43,8 +43,8 @@ F3 "" 0 -50 60 H I C CNN
|
|||
DRAW
|
||||
S -500 600 500 -600 0 1 0 N
|
||||
P 15 0 1 0 -150 400 450 400 450 300 100 300 100 200 450 200 450 100 100 100 100 0 450 0 450 -100 100 -100 100 -200 450 -200 450 -400 N
|
||||
X VDD 1 0 800 200 D 50 50 1 1 W
|
||||
X VSS 2 0 -800 200 U 50 50 1 1 W
|
||||
X VDD 1 -700 450 200 R 50 50 1 1 W
|
||||
X VSS 2 -700 -450 200 R 50 50 1 1 W
|
||||
X CE 3 -700 250 200 R 50 50 1 1 I
|
||||
X CSN 4 -700 150 200 R 50 50 1 1 I
|
||||
X SCK 5 -700 50 200 R 50 50 1 1 I
|
||||
|
|
|
@ -0,0 +1,438 @@
|
|||
Attribution-NonCommercial-ShareAlike 4.0 International
|
||||
|
||||
=======================================================================
|
||||
|
||||
Creative Commons Corporation ("Creative Commons") is not a law firm and
|
||||
does not provide legal services or legal advice. Distribution of
|
||||
Creative Commons public licenses does not create a lawyer-client or
|
||||
other relationship. Creative Commons makes its licenses and related
|
||||
information available on an "as-is" basis. Creative Commons gives no
|
||||
warranties regarding its licenses, any material licensed under their
|
||||
terms and conditions, or any related information. Creative Commons
|
||||
disclaims all liability for damages resulting from their use to the
|
||||
fullest extent possible.
|
||||
|
||||
Using Creative Commons Public Licenses
|
||||
|
||||
Creative Commons public licenses provide a standard set of terms and
|
||||
conditions that creators and other rights holders may use to share
|
||||
original works of authorship and other material subject to copyright
|
||||
and certain other rights specified in the public license below. The
|
||||
following considerations are for informational purposes only, are not
|
||||
exhaustive, and do not form part of our licenses.
|
||||
|
||||
Considerations for licensors: Our public licenses are
|
||||
intended for use by those authorized to give the public
|
||||
permission to use material in ways otherwise restricted by
|
||||
copyright and certain other rights. Our licenses are
|
||||
irrevocable. Licensors should read and understand the terms
|
||||
and conditions of the license they choose before applying it.
|
||||
Licensors should also secure all rights necessary before
|
||||
applying our licenses so that the public can reuse the
|
||||
material as expected. Licensors should clearly mark any
|
||||
material not subject to the license. This includes other CC-
|
||||
licensed material, or material used under an exception or
|
||||
limitation to copyright. More considerations for licensors:
|
||||
wiki.creativecommons.org/Considerations_for_licensors
|
||||
|
||||
Considerations for the public: By using one of our public
|
||||
licenses, a licensor grants the public permission to use the
|
||||
licensed material under specified terms and conditions. If
|
||||
the licensor's permission is not necessary for any reason--for
|
||||
example, because of any applicable exception or limitation to
|
||||
copyright--then that use is not regulated by the license. Our
|
||||
licenses grant only permissions under copyright and certain
|
||||
other rights that a licensor has authority to grant. Use of
|
||||
the licensed material may still be restricted for other
|
||||
reasons, including because others have copyright or other
|
||||
rights in the material. A licensor may make special requests,
|
||||
such as asking that all changes be marked or described.
|
||||
Although not required by our licenses, you are encouraged to
|
||||
respect those requests where reasonable. More_considerations
|
||||
for the public:
|
||||
wiki.creativecommons.org/Considerations_for_licensees
|
||||
|
||||
=======================================================================
|
||||
|
||||
Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International
|
||||
Public License
|
||||
|
||||
By exercising the Licensed Rights (defined below), You accept and agree
|
||||
to be bound by the terms and conditions of this Creative Commons
|
||||
Attribution-NonCommercial-ShareAlike 4.0 International Public License
|
||||
("Public License"). To the extent this Public License may be
|
||||
interpreted as a contract, You are granted the Licensed Rights in
|
||||
consideration of Your acceptance of these terms and conditions, and the
|
||||
Licensor grants You such rights in consideration of benefits the
|
||||
Licensor receives from making the Licensed Material available under
|
||||
these terms and conditions.
|
||||
|
||||
|
||||
Section 1 -- Definitions.
|
||||
|
||||
a. Adapted Material means material subject to Copyright and Similar
|
||||
Rights that is derived from or based upon the Licensed Material
|
||||
and in which the Licensed Material is translated, altered,
|
||||
arranged, transformed, or otherwise modified in a manner requiring
|
||||
permission under the Copyright and Similar Rights held by the
|
||||
Licensor. For purposes of this Public License, where the Licensed
|
||||
Material is a musical work, performance, or sound recording,
|
||||
Adapted Material is always produced where the Licensed Material is
|
||||
synched in timed relation with a moving image.
|
||||
|
||||
b. Adapter's License means the license You apply to Your Copyright
|
||||
and Similar Rights in Your contributions to Adapted Material in
|
||||
accordance with the terms and conditions of this Public License.
|
||||
|
||||
c. BY-NC-SA Compatible License means a license listed at
|
||||
creativecommons.org/compatiblelicenses, approved by Creative
|
||||
Commons as essentially the equivalent of this Public License.
|
||||
|
||||
d. Copyright and Similar Rights means copyright and/or similar rights
|
||||
closely related to copyright including, without limitation,
|
||||
performance, broadcast, sound recording, and Sui Generis Database
|
||||
Rights, without regard to how the rights are labeled or
|
||||
categorized. For purposes of this Public License, the rights
|
||||
specified in Section 2(b)(1)-(2) are not Copyright and Similar
|
||||
Rights.
|
||||
|
||||
e. Effective Technological Measures means those measures that, in the
|
||||
absence of proper authority, may not be circumvented under laws
|
||||
fulfilling obligations under Article 11 of the WIPO Copyright
|
||||
Treaty adopted on December 20, 1996, and/or similar international
|
||||
agreements.
|
||||
|
||||
f. Exceptions and Limitations means fair use, fair dealing, and/or
|
||||
any other exception or limitation to Copyright and Similar Rights
|
||||
that applies to Your use of the Licensed Material.
|
||||
|
||||
g. License Elements means the license attributes listed in the name
|
||||
of a Creative Commons Public License. The License Elements of this
|
||||
Public License are Attribution, NonCommercial, and ShareAlike.
|
||||
|
||||
h. Licensed Material means the artistic or literary work, database,
|
||||
or other material to which the Licensor applied this Public
|
||||
License.
|
||||
|
||||
i. Licensed Rights means the rights granted to You subject to the
|
||||
terms and conditions of this Public License, which are limited to
|
||||
all Copyright and Similar Rights that apply to Your use of the
|
||||
Licensed Material and that the Licensor has authority to license.
|
||||
|
||||
j. Licensor means the individual(s) or entity(ies) granting rights
|
||||
under this Public License.
|
||||
|
||||
k. NonCommercial means not primarily intended for or directed towards
|
||||
commercial advantage or monetary compensation. For purposes of
|
||||
this Public License, the exchange of the Licensed Material for
|
||||
other material subject to Copyright and Similar Rights by digital
|
||||
file-sharing or similar means is NonCommercial provided there is
|
||||
no payment of monetary compensation in connection with the
|
||||
exchange.
|
||||
|
||||
l. Share means to provide material to the public by any means or
|
||||
process that requires permission under the Licensed Rights, such
|
||||
as reproduction, public display, public performance, distribution,
|
||||
dissemination, communication, or importation, and to make material
|
||||
available to the public including in ways that members of the
|
||||
public may access the material from a place and at a time
|
||||
individually chosen by them.
|
||||
|
||||
m. Sui Generis Database Rights means rights other than copyright
|
||||
resulting from Directive 96/9/EC of the European Parliament and of
|
||||
the Council of 11 March 1996 on the legal protection of databases,
|
||||
as amended and/or succeeded, as well as other essentially
|
||||
equivalent rights anywhere in the world.
|
||||
|
||||
n. You means the individual or entity exercising the Licensed Rights
|
||||
under this Public License. Your has a corresponding meaning.
|
||||
|
||||
|
||||
Section 2 -- Scope.
|
||||
|
||||
a. License grant.
|
||||
|
||||
1. Subject to the terms and conditions of this Public License,
|
||||
the Licensor hereby grants You a worldwide, royalty-free,
|
||||
non-sublicensable, non-exclusive, irrevocable license to
|
||||
exercise the Licensed Rights in the Licensed Material to:
|
||||
|
||||
a. reproduce and Share the Licensed Material, in whole or
|
||||
in part, for NonCommercial purposes only; and
|
||||
|
||||
b. produce, reproduce, and Share Adapted Material for
|
||||
NonCommercial purposes only.
|
||||
|
||||
2. Exceptions and Limitations. For the avoidance of doubt, where
|
||||
Exceptions and Limitations apply to Your use, this Public
|
||||
License does not apply, and You do not need to comply with
|
||||
its terms and conditions.
|
||||
|
||||
3. Term. The term of this Public License is specified in Section
|
||||
6(a).
|
||||
|
||||
4. Media and formats; technical modifications allowed. The
|
||||
Licensor authorizes You to exercise the Licensed Rights in
|
||||
all media and formats whether now known or hereafter created,
|
||||
and to make technical modifications necessary to do so. The
|
||||
Licensor waives and/or agrees not to assert any right or
|
||||
authority to forbid You from making technical modifications
|
||||
necessary to exercise the Licensed Rights, including
|
||||
technical modifications necessary to circumvent Effective
|
||||
Technological Measures. For purposes of this Public License,
|
||||
simply making modifications authorized by this Section 2(a)
|
||||
(4) never produces Adapted Material.
|
||||
|
||||
5. Downstream recipients.
|
||||
|
||||
a. Offer from the Licensor -- Licensed Material. Every
|
||||
recipient of the Licensed Material automatically
|
||||
receives an offer from the Licensor to exercise the
|
||||
Licensed Rights under the terms and conditions of this
|
||||
Public License.
|
||||
|
||||
b. Additional offer from the Licensor -- Adapted Material.
|
||||
Every recipient of Adapted Material from You
|
||||
automatically receives an offer from the Licensor to
|
||||
exercise the Licensed Rights in the Adapted Material
|
||||
under the conditions of the Adapter's License You apply.
|
||||
|
||||
c. No downstream restrictions. You may not offer or impose
|
||||
any additional or different terms or conditions on, or
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||||
apply any Effective Technological Measures to, the
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||||
Licensed Material if doing so restricts exercise of the
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||||
Licensed Rights by any recipient of the Licensed
|
||||
Material.
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|
||||
6. No endorsement. Nothing in this Public License constitutes or
|
||||
may be construed as permission to assert or imply that You
|
||||
are, or that Your use of the Licensed Material is, connected
|
||||
with, or sponsored, endorsed, or granted official status by,
|
||||
the Licensor or others designated to receive attribution as
|
||||
provided in Section 3(a)(1)(A)(i).
|
||||
|
||||
b. Other rights.
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||||
|
||||
1. Moral rights, such as the right of integrity, are not
|
||||
licensed under this Public License, nor are publicity,
|
||||
privacy, and/or other similar personality rights; however, to
|
||||
the extent possible, the Licensor waives and/or agrees not to
|
||||
assert any such rights held by the Licensor to the limited
|
||||
extent necessary to allow You to exercise the Licensed
|
||||
Rights, but not otherwise.
|
||||
|
||||
2. Patent and trademark rights are not licensed under this
|
||||
Public License.
|
||||
|
||||
3. To the extent possible, the Licensor waives any right to
|
||||
collect royalties from You for the exercise of the Licensed
|
||||
Rights, whether directly or through a collecting society
|
||||
under any voluntary or waivable statutory or compulsory
|
||||
licensing scheme. In all other cases the Licensor expressly
|
||||
reserves any right to collect such royalties, including when
|
||||
the Licensed Material is used other than for NonCommercial
|
||||
purposes.
|
||||
|
||||
|
||||
Section 3 -- License Conditions.
|
||||
|
||||
Your exercise of the Licensed Rights is expressly made subject to the
|
||||
following conditions.
|
||||
|
||||
a. Attribution.
|
||||
|
||||
1. If You Share the Licensed Material (including in modified
|
||||
form), You must:
|
||||
|
||||
a. retain the following if it is supplied by the Licensor
|
||||
with the Licensed Material:
|
||||
|
||||
i. identification of the creator(s) of the Licensed
|
||||
Material and any others designated to receive
|
||||
attribution, in any reasonable manner requested by
|
||||
the Licensor (including by pseudonym if
|
||||
designated);
|
||||
|
||||
ii. a copyright notice;
|
||||
|
||||
iii. a notice that refers to this Public License;
|
||||
|
||||
iv. a notice that refers to the disclaimer of
|
||||
warranties;
|
||||
|
||||
v. a URI or hyperlink to the Licensed Material to the
|
||||
extent reasonably practicable;
|
||||
|
||||
b. indicate if You modified the Licensed Material and
|
||||
retain an indication of any previous modifications; and
|
||||
|
||||
c. indicate the Licensed Material is licensed under this
|
||||
Public License, and include the text of, or the URI or
|
||||
hyperlink to, this Public License.
|
||||
|
||||
2. You may satisfy the conditions in Section 3(a)(1) in any
|
||||
reasonable manner based on the medium, means, and context in
|
||||
which You Share the Licensed Material. For example, it may be
|
||||
reasonable to satisfy the conditions by providing a URI or
|
||||
hyperlink to a resource that includes the required
|
||||
information.
|
||||
3. If requested by the Licensor, You must remove any of the
|
||||
information required by Section 3(a)(1)(A) to the extent
|
||||
reasonably practicable.
|
||||
|
||||
b. ShareAlike.
|
||||
|
||||
In addition to the conditions in Section 3(a), if You Share
|
||||
Adapted Material You produce, the following conditions also apply.
|
||||
|
||||
1. The Adapter's License You apply must be a Creative Commons
|
||||
license with the same License Elements, this version or
|
||||
later, or a BY-NC-SA Compatible License.
|
||||
|
||||
2. You must include the text of, or the URI or hyperlink to, the
|
||||
Adapter's License You apply. You may satisfy this condition
|
||||
in any reasonable manner based on the medium, means, and
|
||||
context in which You Share Adapted Material.
|
||||
|
||||
3. You may not offer or impose any additional or different terms
|
||||
or conditions on, or apply any Effective Technological
|
||||
Measures to, Adapted Material that restrict exercise of the
|
||||
rights granted under the Adapter's License You apply.
|
||||
|
||||
|
||||
Section 4 -- Sui Generis Database Rights.
|
||||
|
||||
Where the Licensed Rights include Sui Generis Database Rights that
|
||||
apply to Your use of the Licensed Material:
|
||||
|
||||
a. for the avoidance of doubt, Section 2(a)(1) grants You the right
|
||||
to extract, reuse, reproduce, and Share all or a substantial
|
||||
portion of the contents of the database for NonCommercial purposes
|
||||
only;
|
||||
|
||||
b. if You include all or a substantial portion of the database
|
||||
contents in a database in which You have Sui Generis Database
|
||||
Rights, then the database in which You have Sui Generis Database
|
||||
Rights (but not its individual contents) is Adapted Material,
|
||||
including for purposes of Section 3(b); and
|
||||
|
||||
c. You must comply with the conditions in Section 3(a) if You Share
|
||||
all or a substantial portion of the contents of the database.
|
||||
|
||||
For the avoidance of doubt, this Section 4 supplements and does not
|
||||
replace Your obligations under this Public License where the Licensed
|
||||
Rights include other Copyright and Similar Rights.
|
||||
|
||||
|
||||
Section 5 -- Disclaimer of Warranties and Limitation of Liability.
|
||||
|
||||
a. UNLESS OTHERWISE SEPARATELY UNDERTAKEN BY THE LICENSOR, TO THE
|
||||
EXTENT POSSIBLE, THE LICENSOR OFFERS THE LICENSED MATERIAL AS-IS
|
||||
AND AS-AVAILABLE, AND MAKES NO REPRESENTATIONS OR WARRANTIES OF
|
||||
ANY KIND CONCERNING THE LICENSED MATERIAL, WHETHER EXPRESS,
|
||||
IMPLIED, STATUTORY, OR OTHER. THIS INCLUDES, WITHOUT LIMITATION,
|
||||
WARRANTIES OF TITLE, MERCHANTABILITY, FITNESS FOR A PARTICULAR
|
||||
PURPOSE, NON-INFRINGEMENT, ABSENCE OF LATENT OR OTHER DEFECTS,
|
||||
ACCURACY, OR THE PRESENCE OR ABSENCE OF ERRORS, WHETHER OR NOT
|
||||
KNOWN OR DISCOVERABLE. WHERE DISCLAIMERS OF WARRANTIES ARE NOT
|
||||
ALLOWED IN FULL OR IN PART, THIS DISCLAIMER MAY NOT APPLY TO YOU.
|
||||
|
||||
b. TO THE EXTENT POSSIBLE, IN NO EVENT WILL THE LICENSOR BE LIABLE
|
||||
TO YOU ON ANY LEGAL THEORY (INCLUDING, WITHOUT LIMITATION,
|
||||
NEGLIGENCE) OR OTHERWISE FOR ANY DIRECT, SPECIAL, INDIRECT,
|
||||
INCIDENTAL, CONSEQUENTIAL, PUNITIVE, EXEMPLARY, OR OTHER LOSSES,
|
||||
COSTS, EXPENSES, OR DAMAGES ARISING OUT OF THIS PUBLIC LICENSE OR
|
||||
USE OF THE LICENSED MATERIAL, EVEN IF THE LICENSOR HAS BEEN
|
||||
ADVISED OF THE POSSIBILITY OF SUCH LOSSES, COSTS, EXPENSES, OR
|
||||
DAMAGES. WHERE A LIMITATION OF LIABILITY IS NOT ALLOWED IN FULL OR
|
||||
IN PART, THIS LIMITATION MAY NOT APPLY TO YOU.
|
||||
|
||||
c. The disclaimer of warranties and limitation of liability provided
|
||||
above shall be interpreted in a manner that, to the extent
|
||||
possible, most closely approximates an absolute disclaimer and
|
||||
waiver of all liability.
|
||||
|
||||
|
||||
Section 6 -- Term and Termination.
|
||||
|
||||
a. This Public License applies for the term of the Copyright and
|
||||
Similar Rights licensed here. However, if You fail to comply with
|
||||
this Public License, then Your rights under this Public License
|
||||
terminate automatically.
|
||||
|
||||
b. Where Your right to use the Licensed Material has terminated under
|
||||
Section 6(a), it reinstates:
|
||||
|
||||
1. automatically as of the date the violation is cured, provided
|
||||
it is cured within 30 days of Your discovery of the
|
||||
violation; or
|
||||
|
||||
2. upon express reinstatement by the Licensor.
|
||||
|
||||
For the avoidance of doubt, this Section 6(b) does not affect any
|
||||
right the Licensor may have to seek remedies for Your violations
|
||||
of this Public License.
|
||||
|
||||
c. For the avoidance of doubt, the Licensor may also offer the
|
||||
Licensed Material under separate terms or conditions or stop
|
||||
distributing the Licensed Material at any time; however, doing so
|
||||
will not terminate this Public License.
|
||||
|
||||
d. Sections 1, 5, 6, 7, and 8 survive termination of this Public
|
||||
License.
|
||||
|
||||
|
||||
Section 7 -- Other Terms and Conditions.
|
||||
|
||||
a. The Licensor shall not be bound by any additional or different
|
||||
terms or conditions communicated by You unless expressly agreed.
|
||||
|
||||
b. Any arrangements, understandings, or agreements regarding the
|
||||
Licensed Material not stated herein are separate from and
|
||||
independent of the terms and conditions of this Public License.
|
||||
|
||||
|
||||
Section 8 -- Interpretation.
|
||||
|
||||
a. For the avoidance of doubt, this Public License does not, and
|
||||
shall not be interpreted to, reduce, limit, restrict, or impose
|
||||
conditions on any use of the Licensed Material that could lawfully
|
||||
be made without permission under this Public License.
|
||||
|
||||
b. To the extent possible, if any provision of this Public License is
|
||||
deemed unenforceable, it shall be automatically reformed to the
|
||||
minimum extent necessary to make it enforceable. If the provision
|
||||
cannot be reformed, it shall be severed from this Public License
|
||||
without affecting the enforceability of the remaining terms and
|
||||
conditions.
|
||||
|
||||
c. No term or condition of this Public License will be waived and no
|
||||
failure to comply consented to unless expressly agreed to by the
|
||||
Licensor.
|
||||
|
||||
d. Nothing in this Public License constitutes or may be interpreted
|
||||
as a limitation upon, or waiver of, any privileges and immunities
|
||||
that apply to the Licensor or You, including from the legal
|
||||
processes of any jurisdiction or authority.
|
||||
|
||||
=======================================================================
|
||||
|
||||
Creative Commons is not a party to its public
|
||||
licenses. Notwithstanding, Creative Commons may elect to apply one of
|
||||
its public licenses to material it publishes and in those instances
|
||||
will be considered the “Licensor.” The text of the Creative Commons
|
||||
public licenses is dedicated to the public domain under the CC0 Public
|
||||
Domain Dedication. Except for the limited purpose of indicating that
|
||||
material is shared under a Creative Commons public license or as
|
||||
otherwise permitted by the Creative Commons policies published at
|
||||
creativecommons.org/policies, Creative Commons does not authorize the
|
||||
use of the trademark "Creative Commons" or any other trademark or logo
|
||||
of Creative Commons without its prior written consent including,
|
||||
without limitation, in connection with any unauthorized modifications
|
||||
to any of its public licenses or any other arrangements,
|
||||
understandings, or agreements concerning use of licensed material. For
|
||||
the avoidance of doubt, this paragraph does not form part of the
|
||||
public licenses.
|
||||
|
||||
Creative Commons may be contacted at creativecommons.org.
|
||||
|
|
@ -0,0 +1,11 @@
|
|||
# keyplus mini PCB
|
||||
|
||||
![Image of keyplus mini PCB](https://rawgit.com/ahtn/keyboard_pcb/master/keyplus_mini/kicad/keyplus_mini.png)
|
||||
|
||||
## Firmware
|
||||
|
||||
[See here](https://github.com/ahtn/keyplus)
|
||||
|
||||
## License
|
||||
|
||||
[CC-BY-SA](https://creativecommons.org/licenses/by-sa/4.0/)
|
|
@ -0,0 +1,7 @@
|
|||
(fp_lib_table
|
||||
(lib (name conn_usb)(type KiCad)(uri "$(KIPRJMOD)/../kicad_common/footprints/conn_usb.pretty")(options "")(descr ""))
|
||||
(lib (name qfn)(type KiCad)(uri "$(KIPRJMOD)/../kicad_common/footprints/qfn.pretty")(options "")(descr ""))
|
||||
(lib (name logo)(type KiCad)(uri "$(KIPRJMOD)/../kicad_common/footprints/logo.pretty")(options "")(descr ""))
|
||||
(lib (name nordic)(type KiCad)(uri "$(KIPRJMOD)/../kicad_common/footprints/nordic.pretty")(options "")(descr ""))
|
||||
(lib (name kicad_util)(type KiCad)(uri "$(KIPRJMOD)/../kicad_common/footprints/kicad_util.pretty")(options "")(descr ""))
|
||||
)
|
File diff suppressed because it is too large
Load Diff
|
@ -0,0 +1,49 @@
|
|||
update=Tue 05 Dec 2017 16:16:45 AEST
|
||||
version=1
|
||||
last_client=kicad
|
||||
[cvpcb]
|
||||
version=1
|
||||
NetIExt=net
|
||||
[general]
|
||||
version=1
|
||||
[schematic_editor]
|
||||
version=1
|
||||
PageLayoutDescrFile=
|
||||
PlotDirectoryName=plots/
|
||||
SubpartIdSeparator=0
|
||||
SubpartFirstId=65
|
||||
NetFmtName=
|
||||
SpiceForceRefPrefix=0
|
||||
SpiceUseNetNumbers=0
|
||||
LabSize=60
|
||||
[pcbnew]
|
||||
version=1
|
||||
PageLayoutDescrFile=/home/user/code/keyboard_pcb/kicad_common/page_layouts/clear.kicad_wks
|
||||
LastNetListRead=
|
||||
PadDrill=1
|
||||
PadDrillOvalY=1
|
||||
PadSizeH=1.7
|
||||
PadSizeV=1.7
|
||||
PcbTextSizeV=1.5
|
||||
PcbTextSizeH=1.5
|
||||
PcbTextThickness=0.3
|
||||
ModuleTextSizeV=1
|
||||
ModuleTextSizeH=1
|
||||
ModuleTextSizeThickness=0.15
|
||||
SolderMaskClearance=0.03809999999999999
|
||||
SolderMaskMinWidth=0.0508
|
||||
DrawSegmentWidth=0.15
|
||||
BoardOutlineThickness=0.15
|
||||
ModuleOutlineThickness=0.15
|
||||
[eeschema]
|
||||
version=1
|
||||
LibDir=../kicad_common
|
||||
[eeschema/libraries]
|
||||
LibName1=power
|
||||
LibName2=device
|
||||
LibName3=conn
|
||||
LibName4=regul
|
||||
LibName5=libraries/atmel
|
||||
LibName6=libraries/connector
|
||||
LibName7=libraries/microchip
|
||||
LibName8=libraries/nordic
|
|
@ -0,0 +1,914 @@
|
|||
EESchema Schematic File Version 2
|
||||
LIBS:power
|
||||
LIBS:device
|
||||
LIBS:conn
|
||||
LIBS:regul
|
||||
LIBS:atmel
|
||||
LIBS:connector
|
||||
LIBS:microchip
|
||||
LIBS:nordic
|
||||
LIBS:mu_board-cache
|
||||
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|
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|
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F 0 "#PWR07" H 9350 2850 50 0001 C CNN
|
||||
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|
||||
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|
||||
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|
||||
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||||
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||||
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||||
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||||
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||||
PD0
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||||
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||||
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||||
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||||
PD2
|
||||
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||||
PD3
|
||||
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||||
PD4
|
||||
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||||
PD5
|
||||
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||||
PB0
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
PR1
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||||
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||||
PCL
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||||
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||||
PDI
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||||
$Comp
|
||||
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||||
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||||
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||||
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||||
F 1 "+3.3V" H 6050 1915 50 0000 C CNN
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||||
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||||
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||||
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||||
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$Comp
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||||
L C C2
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||||
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||||
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||||
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||||
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||||
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||||
1 7150 2925
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||||
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$Comp
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||||
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||||
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||||
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||||
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||||
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$Comp
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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||||
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$Comp
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L R R4
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||||
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||||
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||||
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$Comp
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L R R3
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||||
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$Comp
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L GND #PWR011
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||||
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||||
F 1 "GND" H 4100 4500 50 0000 C CNN
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||||
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||||
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vbus check pin
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NoConn ~ 2425 5225
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NoConn ~ 2425 5325
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NoConn ~ 2425 5625
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NoConn ~ 2425 5525
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||||
NoConn ~ 2425 6125
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||||
NoConn ~ 2425 6225
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||||
NoConn ~ 2425 6425
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||||
NoConn ~ 2425 6525
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||||
NoConn ~ 2425 5925
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||||
NoConn ~ 2425 5825
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||||
NoConn ~ 1525 6825
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$Comp
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||||
L GND #PWR013
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||||
U 1 1 59BD0C6D
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F 1 "GND" H 3175 4875 50 0000 C CNN
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F 2 "" H 3175 5025 50 0001 C CNN
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||||
F 3 "" H 3175 5025 50 0001 C CNN
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||||
1 3175 5025
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$Comp
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L GND #PWR014
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U 1 1 59BD16B1
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F 1 "GND" H 2075 6775 50 0000 C CNN
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F 2 "" H 2075 6925 50 0001 C CNN
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1 2075 6925
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Text Label 5150 5500 2 39 ~ 0
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D+
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Text Label 5150 5400 2 39 ~ 0
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D-
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||||
U 1 1 59BD7F6C
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F 1 "+BATT" H 7775 3140 50 0000 C CNN
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||||
F 2 "" H 7775 3000 50 0001 C CNN
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F 3 "" H 7775 3000 50 0001 C CNN
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||||
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$Comp
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L +BATT #PWR016
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||||
U 1 1 59BD8217
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F 0 "#PWR016" H 4300 1325 50 0001 C CNN
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||||
F 1 "+BATT" H 4300 1615 50 0000 C CNN
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||||
F 3 "" H 4300 1475 50 0001 C CNN
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||||
1 4300 1475
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1 0 0 -1
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$EndComp
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$Comp
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L GND #PWR017
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||||
U 1 1 59BDDA09
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F 0 "#PWR017" H 7150 2825 50 0001 C CNN
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||||
F 1 "GND" H 7150 2925 50 0000 C CNN
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||||
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||||
F 3 "" H 7150 3075 50 0001 C CNN
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1 7150 3075
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1 0 0 -1
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$EndComp
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$Comp
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L GND #PWR018
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||||
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||||
1 6850 3075
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1 0 0 -1
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$EndComp
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$Comp
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L GND #PWR019
|
||||
U 1 1 59BDDAD3
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F 0 "#PWR019" H 6650 2825 50 0001 C CNN
|
||||
F 1 "GND" H 6650 2925 50 0000 C CNN
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||||
F 2 "" H 6650 3075 50 0001 C CNN
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||||
F 3 "" H 6650 3075 50 0001 C CNN
|
||||
1 6650 3075
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||||
1 0 0 -1
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$Comp
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L GND #PWR020
|
||||
U 1 1 59BDDB1A
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|
||||
F 1 "GND" H 6450 2925 50 0000 C CNN
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||||
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||||
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||||
1 6450 3075
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1 0 0 -1
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$EndComp
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$Comp
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L GND #PWR021
|
||||
U 1 1 59BDDB61
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F 0 "#PWR021" H 6250 2825 39 0001 C CNN
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||||
F 1 "GND" H 6250 2925 50 0000 C CNN
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||||
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F 3 "" H 6250 3075 50 0001 C CNN
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||||
1 6250 3075
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$EndComp
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Text Notes 2075 1100 0 60 ~ 0
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Voltage Regulation and Selection\n
|
||||
Text Notes 2100 1300 0 51 ~ 0
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Note: The battery voltage should be less than\n the voltage output by the 3.3V regulator.
|
||||
$Comp
|
||||
L ATXMEGA-A4U-EPAD U2
|
||||
U 1 1 5A24E79F
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||||
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|
||||
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||||
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||||
F 3 "" H 6050 4500 50 0001 C CNN
|
||||
1 6050 4500
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||||
1 0 0 -1
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$EndComp
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$Comp
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L USB_C_Receptacle J1
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||||
U 1 1 5A25020D
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||||
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||||
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|
||||
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||||
1 1825 5225
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1 0 0 -1
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$EndComp
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Text Label 9950 3025 2 60 ~ 0
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RAW
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Text Label 9950 3125 2 60 ~ 0
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GND
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||||
Text Label 9950 3225 2 60 ~ 0
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||||
RST
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Text Label 9950 3325 2 60 ~ 0
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VCC
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||||
Text Label 8275 3225 0 60 ~ 0
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GND
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Text Label 8275 3325 0 60 ~ 0
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GND
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Text Label 4400 3600 2 60 ~ 0
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RST
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$Comp
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||||
L GND #PWR022
|
||||
U 1 1 5A25576D
|
||||
P 9550 3125
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F 0 "#PWR022" H 9550 2875 50 0001 C CNN
|
||||
F 1 "GND" H 9550 2975 50 0000 C CNN
|
||||
F 2 "" H 9550 3125 50 0001 C CNN
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||||
F 3 "" H 9550 3125 50 0001 C CNN
|
||||
1 9550 3125
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-1 0 0 -1
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$EndComp
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||||
$Comp
|
||||
L GND #PWR023
|
||||
U 1 1 5A255AE9
|
||||
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|
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F 0 "#PWR023" H 8750 3175 50 0001 C CNN
|
||||
F 1 "GND" H 8750 3275 50 0000 C CNN
|
||||
F 2 "" H 8750 3425 50 0001 C CNN
|
||||
F 3 "" H 8750 3425 50 0001 C CNN
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||||
1 8750 3425
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$EndComp
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Text Label 8275 3425 0 60 ~ 0
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PE0
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Text Label 8275 3525 0 60 ~ 0
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PE1
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PE2
|
||||
Text Label 8275 3625 0 60 ~ 0
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PE2
|
||||
Text Label 8275 3725 0 60 ~ 0
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PE3
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Text Label 8275 3125 0 60 ~ 0
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PD2
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||||
Text Label 8275 3025 0 60 ~ 0
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PD3
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Text Label 9950 3425 2 60 ~ 0
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PD5
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Text Label 7775 3625 2 60 ~ 0
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PA0
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PA1
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PA4
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PA5
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Text Label 8275 3925 0 60 ~ 0
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PA6
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||||
Text Label 10450 3425 0 60 ~ 0
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PDI
|
||||
$Comp
|
||||
L Conn_01x12 J4
|
||||
U 1 1 5A265388
|
||||
P 10150 3525
|
||||
F 0 "J4" H 10150 4125 50 0000 C CNN
|
||||
F 1 "Conn_01x13" H 10150 2825 50 0001 C CNN
|
||||
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|
||||
F 3 "" H 10150 3525 50 0001 C CNN
|
||||
1 10150 3525
|
||||
1 0 0 -1
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$EndComp
|
||||
$Comp
|
||||
L nRF24L01_module U3
|
||||
U 1 1 5A268ECA
|
||||
P 9900 5475
|
||||
F 0 "U3" H 9450 6125 60 0000 C CNN
|
||||
F 1 "nRF24L01_module" H 10350 4825 60 0000 C CNN
|
||||
F 2 "nordic:NRF24L01-Module-SMD" H 9900 5425 60 0001 C CNN
|
||||
F 3 "" H 9900 5425 60 0001 C CNN
|
||||
1 9900 5475
|
||||
1 0 0 -1
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$EndComp
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||||
$Comp
|
||||
L +3.3V #PWR024
|
||||
U 1 1 5A269D66
|
||||
P 9200 4825
|
||||
F 0 "#PWR024" H 9200 4675 50 0001 C CNN
|
||||
F 1 "+3.3V" H 9200 4965 50 0000 C CNN
|
||||
F 2 "" H 9200 4825 50 0001 C CNN
|
||||
F 3 "" H 9200 4825 50 0001 C CNN
|
||||
1 9200 4825
|
||||
1 0 0 -1
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$EndComp
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||||
$Comp
|
||||
L GND #PWR025
|
||||
U 1 1 5A269E8F
|
||||
P 9200 6100
|
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F 0 "#PWR025" H 9200 5850 50 0001 C CNN
|
||||
F 1 "GND" H 9200 5950 50 0000 C CNN
|
||||
F 2 "" H 9200 6100 50 0001 C CNN
|
||||
F 3 "" H 9200 6100 50 0001 C CNN
|
||||
1 9200 6100
|
||||
1 0 0 -1
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$EndComp
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Text Label 9200 5425 2 60 ~ 0
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PC7
|
||||
Text Label 6950 5400 0 60 ~ 0
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PC6
|
||||
Text Label 9200 5325 2 60 ~ 0
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PC4
|
||||
Text Label 9200 5525 2 60 ~ 0
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||||
PC5
|
||||
Text Label 7775 3525 2 60 ~ 0
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PR1
|
||||
$Comp
|
||||
L Conn_01x08 J5
|
||||
U 1 1 5A26C467
|
||||
P 10250 3725
|
||||
F 0 "J5" H 10250 4125 50 0000 C CNN
|
||||
F 1 "Conn_01x06" H 10250 3325 50 0001 C CNN
|
||||
F 2 "Conn_PinHeader_2.54mm:PinHeader_1x08_P2.54mm_Vertical" H 10250 3725 50 0001 C CNN
|
||||
F 3 "" H 10250 3725 50 0001 C CNN
|
||||
1 10250 3725
|
||||
-1 0 0 -1
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$EndComp
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||||
Text Label 8275 4025 0 60 ~ 0
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PA7
|
||||
Text Label 9950 3725 2 60 ~ 0
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PD0
|
||||
Text Label 9950 3625 2 60 ~ 0
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PD1
|
||||
Text Label 9950 3525 2 60 ~ 0
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PD4
|
||||
Text Label 7775 4125 2 60 ~ 0
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||||
PB0
|
||||
Text Label 8275 4125 0 60 ~ 0
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PB1
|
||||
Text Label 10450 4125 0 60 ~ 0
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PB2
|
||||
Text Label 10450 4025 0 60 ~ 0
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PB3
|
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Text Label 10450 3925 0 60 ~ 0
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PC0
|
||||
Text Label 10450 3825 0 60 ~ 0
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PC1
|
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Text Label 10450 3725 0 60 ~ 0
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PC2
|
||||
Text Label 10450 3625 0 60 ~ 0
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PC3
|
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Text Label 9950 4125 2 60 ~ 0
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PC4
|
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Text Label 9950 4025 2 60 ~ 0
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PC5
|
||||
Text Label 9950 3825 2 60 ~ 0
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||||
PC7
|
||||
Text Label 9950 3925 2 60 ~ 0
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PC6
|
||||
$Comp
|
||||
L Conn_01x12 J2
|
||||
U 1 1 5A26D5CC
|
||||
P 8075 3525
|
||||
F 0 "J2" H 8075 4125 50 0000 C CNN
|
||||
F 1 "Conn_01x11" H 8075 2925 50 0001 C CNN
|
||||
F 2 "Conn_PinHeader_2.54mm:PinHeader_1x12_P2.54mm_Vertical" H 8075 3525 50 0001 C CNN
|
||||
F 3 "" H 8075 3525 50 0001 C CNN
|
||||
1 8075 3525
|
||||
-1 0 0 -1
|
||||
$EndComp
|
||||
$Comp
|
||||
L Conn_01x08 J3
|
||||
U 1 1 5A26D970
|
||||
P 7975 3725
|
||||
F 0 "J3" H 7975 4125 50 0000 C CNN
|
||||
F 1 "Conn_01x08" H 7975 3225 50 0001 C CNN
|
||||
F 2 "Conn_PinHeader_2.54mm:PinHeader_1x08_P2.54mm_Vertical" H 7975 3725 50 0001 C CNN
|
||||
F 3 "" H 7975 3725 50 0001 C CNN
|
||||
1 7975 3725
|
||||
1 0 0 -1
|
||||
$EndComp
|
||||
Text Label 9200 5725 2 60 ~ 0
|
||||
PB2
|
||||
Text Label 9200 5225 2 60 ~ 0
|
||||
PB3
|
||||
Text Label 10450 3525 0 60 ~ 0
|
||||
GND
|
||||
NoConn ~ 3625 2475
|
||||
$Comp
|
||||
L C C1
|
||||
U 1 1 5912FD33
|
||||
P 3850 2575
|
||||
F 0 "C1" H 3750 2675 50 0000 L CNN
|
||||
F 1 "1uF" H 3600 2575 50 0000 L CNN
|
||||
F 2 "Capacitor_SMD:C_0402_1005Metric" H 3888 2425 50 0001 C CNN
|
||||
F 3 "" H 3850 2575 50 0001 C CNN
|
||||
1 3850 2575
|
||||
-1 0 0 1
|
||||
$EndComp
|
||||
$Comp
|
||||
L GND #PWR026
|
||||
U 1 1 5A277B59
|
||||
P 3850 2725
|
||||
F 0 "#PWR026" H 3850 2475 50 0001 C CNN
|
||||
F 1 "GND" H 3850 2575 50 0000 C CNN
|
||||
F 2 "" H 3850 2725 50 0001 C CNN
|
||||
F 3 "" H 3850 2725 50 0001 C CNN
|
||||
1 3850 2725
|
||||
1 0 0 -1
|
||||
$EndComp
|
||||
$Comp
|
||||
L MIC5216-3.3BM5 U1
|
||||
U 1 1 5A277EE5
|
||||
P 3325 2475
|
||||
F 0 "U1" H 3175 2700 50 0000 C CNN
|
||||
F 1 "MIC5216-3.3BM5" H 3325 2700 50 0000 L CNN
|
||||
F 2 "Package_TO_SOT_SMD:SOT-23-5" H 3325 2800 50 0001 C CNN
|
||||
F 3 "" H 3325 2475 50 0001 C CNN
|
||||
1 3325 2475
|
||||
1 0 0 -1
|
||||
$EndComp
|
||||
Entry Wire Line
|
||||
9400 4225 9500 4125
|
||||
Wire Wire Line
|
||||
5600 5800 6200 5800
|
||||
Connection ~ 6000 5800
|
||||
Connection ~ 6100 5800
|
||||
Wire Wire Line
|
||||
6200 5800 6200 6000
|
||||
Connection ~ 5900 5800
|
||||
Wire Wire Line
|
||||
4100 3950 4100 4200
|
||||
Wire Wire Line
|
||||
4100 4500 4100 4650
|
||||
Connection ~ 4100 4100
|
||||
Wire Wire Line
|
||||
9950 3025 9700 3025
|
||||
Wire Wire Line
|
||||
9700 3025 9700 2775
|
||||
Wire Wire Line
|
||||
2925 4875 2925 5025
|
||||
Wire Wire Line
|
||||
3175 4875 3175 5025
|
||||
Wire Wire Line
|
||||
2925 4575 2925 4525
|
||||
Wire Wire Line
|
||||
2925 4525 2425 4525
|
||||
Wire Wire Line
|
||||
3175 4575 3175 4425
|
||||
Wire Wire Line
|
||||
3175 4425 2425 4425
|
||||
Wire Wire Line
|
||||
1625 6825 2225 6825
|
||||
Connection ~ 1725 6825
|
||||
Connection ~ 1825 6825
|
||||
Wire Wire Line
|
||||
2075 6825 2075 6925
|
||||
Connection ~ 1925 6825
|
||||
Wire Wire Line
|
||||
2600 5500 5150 5500
|
||||
Wire Wire Line
|
||||
2700 5400 5150 5400
|
||||
Wire Wire Line
|
||||
2425 3650 4100 3650
|
||||
Connection ~ 2800 3650
|
||||
Wire Wire Line
|
||||
6050 1775 6400 1775
|
||||
Wire Wire Line
|
||||
6050 3200 6050 1775
|
||||
Wire Wire Line
|
||||
2800 2025 2500 2025
|
||||
Wire Wire Line
|
||||
5150 4100 4100 4100
|
||||
Wire Wire Line
|
||||
4300 1675 4300 1475
|
||||
Wire Wire Line
|
||||
4400 3600 5150 3600
|
||||
Wire Wire Line
|
||||
4925 3475 4925 3600
|
||||
Connection ~ 4925 3600
|
||||
Connection ~ 5750 3200
|
||||
Wire Wire Line
|
||||
6050 2775 7150 2775
|
||||
Connection ~ 6250 2775
|
||||
Connection ~ 6450 2775
|
||||
Connection ~ 6650 2775
|
||||
Connection ~ 6850 2775
|
||||
Connection ~ 6050 2775
|
||||
Wire Notes Line
|
||||
2075 1125 5525 1125
|
||||
Wire Notes Line
|
||||
5525 1125 5525 3000
|
||||
Wire Notes Line
|
||||
5525 3000 2075 3000
|
||||
Wire Notes Line
|
||||
2075 3000 2075 1125
|
||||
Wire Wire Line
|
||||
5650 3200 6050 3200
|
||||
Connection ~ 5850 3200
|
||||
Wire Wire Line
|
||||
2425 4725 2425 4825
|
||||
Wire Wire Line
|
||||
2425 4925 2425 5025
|
||||
Wire Wire Line
|
||||
2425 5025 2600 5025
|
||||
Wire Wire Line
|
||||
2600 5025 2600 5500
|
||||
Wire Wire Line
|
||||
2700 5400 2700 4825
|
||||
Wire Wire Line
|
||||
2700 4825 2425 4825
|
||||
Wire Wire Line
|
||||
2425 3650 2425 4225
|
||||
Connection ~ 2425 4125
|
||||
Connection ~ 2425 4025
|
||||
Connection ~ 2425 3925
|
||||
Wire Wire Line
|
||||
9950 3325 9350 3325
|
||||
Wire Wire Line
|
||||
9350 3325 9350 3000
|
||||
Wire Wire Line
|
||||
9950 3125 9550 3125
|
||||
Wire Wire Line
|
||||
8275 3225 8750 3225
|
||||
Wire Wire Line
|
||||
8750 3225 8750 3425
|
||||
Wire Wire Line
|
||||
8275 3325 8750 3325
|
||||
Connection ~ 8750 3325
|
||||
Wire Wire Line
|
||||
7775 3425 7775 3000
|
||||
Wire Wire Line
|
||||
9200 4825 9200 5025
|
||||
Wire Wire Line
|
||||
9200 6100 9200 5925
|
||||
Wire Wire Line
|
||||
3025 2375 3025 2475
|
||||
Wire Wire Line
|
||||
3625 2375 4300 2375
|
||||
Wire Wire Line
|
||||
4300 1475 3950 1475
|
||||
Wire Wire Line
|
||||
4300 2375 4300 2275
|
||||
Wire Wire Line
|
||||
3850 2375 3850 2425
|
||||
Connection ~ 3850 2375
|
||||
Wire Wire Line
|
||||
2800 2025 2800 3650
|
||||
Connection ~ 2800 2375
|
||||
Wire Wire Line
|
||||
2800 2375 3025 2375
|
||||
Wire Wire Line
|
||||
8200 4500 10700 4500
|
||||
Wire Wire Line
|
||||
9200 5725 8100 5725
|
||||
Wire Wire Line
|
||||
8100 5725 8100 4400
|
||||
Wire Wire Line
|
||||
8100 4400 10650 4400
|
||||
Wire Wire Line
|
||||
10700 4500 10700 4025
|
||||
Wire Wire Line
|
||||
10700 4025 10450 4025
|
||||
Wire Wire Line
|
||||
10450 4125 10650 4125
|
||||
Wire Wire Line
|
||||
10650 4125 10650 4400
|
||||
Wire Bus Line
|
||||
9400 3925 9400 4225
|
||||
Wire Bus Line
|
||||
8825 4225 8825 5525
|
||||
Wire Wire Line
|
||||
9500 4125 9950 4125
|
||||
Wire Wire Line
|
||||
9950 4025 9500 4025
|
||||
Wire Wire Line
|
||||
9500 3925 9950 3925
|
||||
Wire Wire Line
|
||||
9500 3825 9950 3825
|
||||
Entry Wire Line
|
||||
8825 5225 8925 5325
|
||||
Wire Wire Line
|
||||
9200 5225 9200 5075
|
||||
Wire Wire Line
|
||||
9200 5075 8200 5075
|
||||
Wire Wire Line
|
||||
8200 5075 8200 4500
|
||||
Entry Wire Line
|
||||
8825 5325 8925 5425
|
||||
Entry Wire Line
|
||||
8825 5425 8925 5525
|
||||
Entry Wire Line
|
||||
8825 5525 8925 5625
|
||||
Wire Wire Line
|
||||
9200 5425 8925 5425
|
||||
Wire Wire Line
|
||||
9200 5325 8925 5325
|
||||
Wire Wire Line
|
||||
9200 5525 8925 5525
|
||||
Wire Wire Line
|
||||
9200 5625 8925 5625
|
||||
$Comp
|
||||
L PWR_FLAG #FLG027
|
||||
U 1 1 5A27A7EB
|
||||
P 2225 6825
|
||||
F 0 "#FLG027" H 2225 6900 50 0001 C CNN
|
||||
F 1 "PWR_FLAG" H 2225 6975 39 0000 C CNN
|
||||
F 2 "" H 2225 6825 50 0001 C CNN
|
||||
F 3 "" H 2225 6825 50 0001 C CNN
|
||||
1 2225 6825
|
||||
1 0 0 -1
|
||||
$EndComp
|
||||
Connection ~ 2075 6825
|
||||
Wire Wire Line
|
||||
4500 1975 6050 1975
|
||||
Connection ~ 6050 1975
|
||||
Wire Bus Line
|
||||
9400 4225 8825 4225
|
||||
Entry Wire Line
|
||||
9400 4125 9500 4025
|
||||
Entry Wire Line
|
||||
9400 4025 9500 3925
|
||||
Entry Wire Line
|
||||
9400 3925 9500 3825
|
||||
$EndSCHEMATC
|
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Loading…
Reference in New Issue